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Thomas S Fix

Examiner (ID: 3871)

Most Active Art Unit
3658
Art Unit(s)
3658
Total Applications
312
Issued Applications
168
Pending Applications
65
Abandoned Applications
79

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1211885 [patent_doc_number] => 06705006 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-16 [patent_title] => 'Method for replacing an electrical net on a printed circuit board' [patent_app_type] => B2 [patent_app_number] => 10/335986 [patent_app_country] => US [patent_app_date] => 2003-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2436 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/705/06705006.pdf [firstpage_image] =>[orig_patent_app_number] => 10335986 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/335986
Method for replacing an electrical net on a printed circuit board Jan 2, 2003 Issued
Array ( [id] => 1242841 [patent_doc_number] => 06675474 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-01-13 [patent_title] => 'Electronic component mounted member and repair method thereof' [patent_app_type] => B2 [patent_app_number] => 10/309597 [patent_app_country] => US [patent_app_date] => 2002-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4422 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/675/06675474.pdf [firstpage_image] =>[orig_patent_app_number] => 10309597 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/309597
Electronic component mounted member and repair method thereof Dec 2, 2002 Issued
Array ( [id] => 6685911 [patent_doc_number] => 20030029633 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-13 [patent_title] => 'Interconnecting substrates for electrical coupling of microelectronic components' [patent_app_type] => new [patent_app_number] => 10/266847 [patent_app_country] => US [patent_app_date] => 2002-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4443 [patent_no_of_claims] => 51 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20030029633.pdf [firstpage_image] =>[orig_patent_app_number] => 10266847 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/266847
Method of Interconnecting substrates for electrical coupling of microelectronic components Oct 6, 2002 Issued
Array ( [id] => 1158648 [patent_doc_number] => 06762367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-13 [patent_title] => 'Electronic package having high density signal wires with low resistance' [patent_app_type] => B2 [patent_app_number] => 10/246147 [patent_app_country] => US [patent_app_date] => 2002-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5928 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 285 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/762/06762367.pdf [firstpage_image] =>[orig_patent_app_number] => 10246147 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/246147
Electronic package having high density signal wires with low resistance Sep 16, 2002 Issued
Array ( [id] => 6494625 [patent_doc_number] => 20020190365 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-19 [patent_title] => 'Non-contact type IC card and process for manufacturing-same' [patent_app_type] => new [patent_app_number] => 10/226608 [patent_app_country] => US [patent_app_date] => 2002-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4393 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0190/20020190365.pdf [firstpage_image] =>[orig_patent_app_number] => 10226608 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/226608
Non-contact type IC card and process for manufacturing-same Aug 22, 2002 Issued
Array ( [id] => 1157597 [patent_doc_number] => 06765151 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-20 [patent_title] => 'Enhanced high temperature coated superconductors' [patent_app_type] => B2 [patent_app_number] => 10/154566 [patent_app_country] => US [patent_app_date] => 2002-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 14217 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/765/06765151.pdf [firstpage_image] =>[orig_patent_app_number] => 10154566 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/154566
Enhanced high temperature coated superconductors May 23, 2002 Issued
Array ( [id] => 1217661 [patent_doc_number] => 06706971 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-16 [patent_title] => 'Stackable microcircuit layer formed from a plastic encapsulated microcircuit' [patent_app_type] => B2 [patent_app_number] => 10/142557 [patent_app_country] => US [patent_app_date] => 2002-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 0 [patent_no_of_words] => 4670 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/706/06706971.pdf [firstpage_image] =>[orig_patent_app_number] => 10142557 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/142557
Stackable microcircuit layer formed from a plastic encapsulated microcircuit May 9, 2002 Issued
Array ( [id] => 7625244 [patent_doc_number] => 06723926 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-20 [patent_title] => 'Mounting configuration of electric and/or electronic components on a printed circuit board' [patent_app_type] => B2 [patent_app_number] => 10/134929 [patent_app_country] => US [patent_app_date] => 2002-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1973 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 5 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/723/06723926.pdf [firstpage_image] =>[orig_patent_app_number] => 10134929 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/134929
Mounting configuration of electric and/or electronic components on a printed circuit board Apr 28, 2002 Issued
Array ( [id] => 6385348 [patent_doc_number] => 20020180004 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Circuitized substrate for high-frequency applications' [patent_app_type] => new [patent_app_number] => 10/125624 [patent_app_country] => US [patent_app_date] => 2002-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4454 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20020180004.pdf [firstpage_image] =>[orig_patent_app_number] => 10125624 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/125624
Circuitized substrate for high-frequency applications Apr 17, 2002 Issued
Array ( [id] => 6517445 [patent_doc_number] => 20020108775 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-15 [patent_title] => 'Electric circuit interconnection system using a virtual mirror cross over package' [patent_app_type] => new [patent_app_number] => 10/122581 [patent_app_country] => US [patent_app_date] => 2002-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3874 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20020108775.pdf [firstpage_image] =>[orig_patent_app_number] => 10122581 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/122581
Electronic circuit interconnection system using a virtual mirror cross over package Apr 14, 2002 Issued
Array ( [id] => 1309024 [patent_doc_number] => 06617517 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-09 [patent_title] => 'Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink' [patent_app_type] => B2 [patent_app_number] => 10/116573 [patent_app_country] => US [patent_app_date] => 2002-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 0 [patent_no_of_words] => 4342 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/617/06617517.pdf [firstpage_image] =>[orig_patent_app_number] => 10116573 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/116573
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink Apr 3, 2002 Issued
Array ( [id] => 5899962 [patent_doc_number] => 20020139574 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board' [patent_app_type] => new [patent_app_number] => 10/114775 [patent_app_country] => US [patent_app_date] => 2002-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 11427 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0139/20020139574.pdf [firstpage_image] =>[orig_patent_app_number] => 10114775 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/114775
Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board Mar 31, 2002 Issued
Array ( [id] => 6794239 [patent_doc_number] => 20030173112 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-09-18 [patent_title] => 'Interconnect bus crossover for MEMS' [patent_app_type] => new [patent_app_number] => 10/098886 [patent_app_country] => US [patent_app_date] => 2002-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5472 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20030173112.pdf [firstpage_image] =>[orig_patent_app_number] => 10098886 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/098886
Interconnect bus crossover for MEMS Mar 14, 2002 Issued
Array ( [id] => 1266027 [patent_doc_number] => 06660943 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-09 [patent_title] => 'Underfilling material for semiconductor package' [patent_app_type] => B1 [patent_app_number] => 10/019299 [patent_app_country] => US [patent_app_date] => 2002-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 0 [patent_no_of_words] => 5656 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/660/06660943.pdf [firstpage_image] =>[orig_patent_app_number] => 10019299 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/019299
Underfilling material for semiconductor package Mar 10, 2002 Issued
Array ( [id] => 1181524 [patent_doc_number] => 06740821 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-05-25 [patent_title] => 'Selectively configurable circuit board' [patent_app_type] => B1 [patent_app_number] => 10/086956 [patent_app_country] => US [patent_app_date] => 2002-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 6816 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/740/06740821.pdf [firstpage_image] =>[orig_patent_app_number] => 10086956 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/086956
Selectively configurable circuit board Feb 28, 2002 Issued
Array ( [id] => 6685907 [patent_doc_number] => 20030029629 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-13 [patent_title] => 'Methods for joining high temperature superconducting components in a superconducting cable with negligible critical current degradation and articles of manufacture in accordance therewith' [patent_app_type] => new [patent_app_number] => 10/081197 [patent_app_country] => US [patent_app_date] => 2002-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5723 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20030029629.pdf [firstpage_image] =>[orig_patent_app_number] => 10081197 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/081197
Methods for joining high temperature superconducting components in a superconducting cable with negligible critical current degradation and articles of manufacture in accordance therewith Feb 21, 2002 Abandoned
Array ( [id] => 6363003 [patent_doc_number] => 20020117329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-29 [patent_title] => 'Components with releasable leads' [patent_app_type] => new [patent_app_number] => 10/058470 [patent_app_country] => US [patent_app_date] => 2002-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 9139 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20020117329.pdf [firstpage_image] =>[orig_patent_app_number] => 10058470 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/058470
Components with releasable leads Jan 27, 2002 Issued
Array ( [id] => 1427243 [patent_doc_number] => 06504108 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-01-07 [patent_title] => 'Electrical connector having stand-offs between solder balls thereof' [patent_app_type] => B1 [patent_app_number] => 10/040347 [patent_app_country] => US [patent_app_date] => 2001-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1704 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/504/06504108.pdf [firstpage_image] =>[orig_patent_app_number] => 10040347 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/040347
Electrical connector having stand-offs between solder balls thereof Dec 27, 2001 Issued
Array ( [id] => 1210604 [patent_doc_number] => 06713687 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Printed wiring board and method for manufacturing printed wiring board' [patent_app_type] => B2 [patent_app_number] => 10/022222 [patent_app_country] => US [patent_app_date] => 2001-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 5793 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713687.pdf [firstpage_image] =>[orig_patent_app_number] => 10022222 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/022222
Printed wiring board and method for manufacturing printed wiring board Dec 19, 2001 Issued
Array ( [id] => 1124720 [patent_doc_number] => 06794585 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-21 [patent_title] => 'Printed circuit board having filled throughole with corner rounded portion and manufacturing method' [patent_app_type] => B2 [patent_app_number] => 10/006547 [patent_app_country] => US [patent_app_date] => 2001-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4861 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/794/06794585.pdf [firstpage_image] =>[orig_patent_app_number] => 10006547 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/006547
Printed circuit board having filled throughole with corner rounded portion and manufacturing method Dec 3, 2001 Issued
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