Thomas S Fix
Examiner (ID: 3871)
Most Active Art Unit | 3658 |
Art Unit(s) | 3658 |
Total Applications | 312 |
Issued Applications | 168 |
Pending Applications | 65 |
Abandoned Applications | 79 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1211885
[patent_doc_number] => 06705006
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-16
[patent_title] => 'Method for replacing an electrical net on a printed circuit board'
[patent_app_type] => B2
[patent_app_number] => 10/335986
[patent_app_country] => US
[patent_app_date] => 2003-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2436
[patent_no_of_claims] => 11
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[patent_words_short_claim] => 197
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/705/06705006.pdf
[firstpage_image] =>[orig_patent_app_number] => 10335986
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/335986 | Method for replacing an electrical net on a printed circuit board | Jan 2, 2003 | Issued |
Array
(
[id] => 1242841
[patent_doc_number] => 06675474
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-01-13
[patent_title] => 'Electronic component mounted member and repair method thereof'
[patent_app_type] => B2
[patent_app_number] => 10/309597
[patent_app_country] => US
[patent_app_date] => 2002-12-03
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/675/06675474.pdf
[firstpage_image] =>[orig_patent_app_number] => 10309597
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/309597 | Electronic component mounted member and repair method thereof | Dec 2, 2002 | Issued |
Array
(
[id] => 6685911
[patent_doc_number] => 20030029633
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-13
[patent_title] => 'Interconnecting substrates for electrical coupling of microelectronic components'
[patent_app_type] => new
[patent_app_number] => 10/266847
[patent_app_country] => US
[patent_app_date] => 2002-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0029/20030029633.pdf
[firstpage_image] =>[orig_patent_app_number] => 10266847
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/266847 | Method of Interconnecting substrates for electrical coupling of microelectronic components | Oct 6, 2002 | Issued |
Array
(
[id] => 1158648
[patent_doc_number] => 06762367
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-13
[patent_title] => 'Electronic package having high density signal wires with low resistance'
[patent_app_type] => B2
[patent_app_number] => 10/246147
[patent_app_country] => US
[patent_app_date] => 2002-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 5928
[patent_no_of_claims] => 26
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/762/06762367.pdf
[firstpage_image] =>[orig_patent_app_number] => 10246147
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/246147 | Electronic package having high density signal wires with low resistance | Sep 16, 2002 | Issued |
Array
(
[id] => 6494625
[patent_doc_number] => 20020190365
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-19
[patent_title] => 'Non-contact type IC card and process for manufacturing-same'
[patent_app_type] => new
[patent_app_number] => 10/226608
[patent_app_country] => US
[patent_app_date] => 2002-08-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0190/20020190365.pdf
[firstpage_image] =>[orig_patent_app_number] => 10226608
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/226608 | Non-contact type IC card and process for manufacturing-same | Aug 22, 2002 | Issued |
Array
(
[id] => 1157597
[patent_doc_number] => 06765151
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-20
[patent_title] => 'Enhanced high temperature coated superconductors'
[patent_app_type] => B2
[patent_app_number] => 10/154566
[patent_app_country] => US
[patent_app_date] => 2002-05-24
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[pdf_file] => patents/06/765/06765151.pdf
[firstpage_image] =>[orig_patent_app_number] => 10154566
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/154566 | Enhanced high temperature coated superconductors | May 23, 2002 | Issued |
Array
(
[id] => 1217661
[patent_doc_number] => 06706971
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-16
[patent_title] => 'Stackable microcircuit layer formed from a plastic encapsulated microcircuit'
[patent_app_type] => B2
[patent_app_number] => 10/142557
[patent_app_country] => US
[patent_app_date] => 2002-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 4670
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/706/06706971.pdf
[firstpage_image] =>[orig_patent_app_number] => 10142557
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/142557 | Stackable microcircuit layer formed from a plastic encapsulated microcircuit | May 9, 2002 | Issued |
Array
(
[id] => 7625244
[patent_doc_number] => 06723926
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-04-20
[patent_title] => 'Mounting configuration of electric and/or electronic components on a printed circuit board'
[patent_app_type] => B2
[patent_app_number] => 10/134929
[patent_app_country] => US
[patent_app_date] => 2002-04-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[patent_no_of_words] => 1973
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/723/06723926.pdf
[firstpage_image] =>[orig_patent_app_number] => 10134929
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/134929 | Mounting configuration of electric and/or electronic components on a printed circuit board | Apr 28, 2002 | Issued |
Array
(
[id] => 6385348
[patent_doc_number] => 20020180004
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Circuitized substrate for high-frequency applications'
[patent_app_type] => new
[patent_app_number] => 10/125624
[patent_app_country] => US
[patent_app_date] => 2002-04-18
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[pdf_file] => publications/A1/0180/20020180004.pdf
[firstpage_image] =>[orig_patent_app_number] => 10125624
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/125624 | Circuitized substrate for high-frequency applications | Apr 17, 2002 | Issued |
Array
(
[id] => 6517445
[patent_doc_number] => 20020108775
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-15
[patent_title] => 'Electric circuit interconnection system using a virtual mirror cross over package'
[patent_app_type] => new
[patent_app_number] => 10/122581
[patent_app_country] => US
[patent_app_date] => 2002-04-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0108/20020108775.pdf
[firstpage_image] =>[orig_patent_app_number] => 10122581
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/122581 | Electronic circuit interconnection system using a virtual mirror cross over package | Apr 14, 2002 | Issued |
Array
(
[id] => 1309024
[patent_doc_number] => 06617517
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-09
[patent_title] => 'Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink'
[patent_app_type] => B2
[patent_app_number] => 10/116573
[patent_app_country] => US
[patent_app_date] => 2002-04-04
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/617/06617517.pdf
[firstpage_image] =>[orig_patent_app_number] => 10116573
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/116573 | Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink | Apr 3, 2002 | Issued |
Array
(
[id] => 5899962
[patent_doc_number] => 20020139574
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-03
[patent_title] => 'Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board'
[patent_app_type] => new
[patent_app_number] => 10/114775
[patent_app_country] => US
[patent_app_date] => 2002-04-01
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[pdf_file] => publications/A1/0139/20020139574.pdf
[firstpage_image] =>[orig_patent_app_number] => 10114775
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/114775 | Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board | Mar 31, 2002 | Issued |
Array
(
[id] => 6794239
[patent_doc_number] => 20030173112
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-09-18
[patent_title] => 'Interconnect bus crossover for MEMS'
[patent_app_type] => new
[patent_app_number] => 10/098886
[patent_app_country] => US
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[pdf_file] => publications/A1/0173/20030173112.pdf
[firstpage_image] =>[orig_patent_app_number] => 10098886
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/098886 | Interconnect bus crossover for MEMS | Mar 14, 2002 | Issued |
Array
(
[id] => 1266027
[patent_doc_number] => 06660943
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-09
[patent_title] => 'Underfilling material for semiconductor package'
[patent_app_type] => B1
[patent_app_number] => 10/019299
[patent_app_country] => US
[patent_app_date] => 2002-03-11
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/660/06660943.pdf
[firstpage_image] =>[orig_patent_app_number] => 10019299
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/019299 | Underfilling material for semiconductor package | Mar 10, 2002 | Issued |
Array
(
[id] => 1181524
[patent_doc_number] => 06740821
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-05-25
[patent_title] => 'Selectively configurable circuit board'
[patent_app_type] => B1
[patent_app_number] => 10/086956
[patent_app_country] => US
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[pdf_file] => patents/06/740/06740821.pdf
[firstpage_image] =>[orig_patent_app_number] => 10086956
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/086956 | Selectively configurable circuit board | Feb 28, 2002 | Issued |
Array
(
[id] => 6685907
[patent_doc_number] => 20030029629
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-13
[patent_title] => 'Methods for joining high temperature superconducting components in a superconducting cable with negligible critical current degradation and articles of manufacture in accordance therewith'
[patent_app_type] => new
[patent_app_number] => 10/081197
[patent_app_country] => US
[patent_app_date] => 2002-02-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0029/20030029629.pdf
[firstpage_image] =>[orig_patent_app_number] => 10081197
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/081197 | Methods for joining high temperature superconducting components in a superconducting cable with negligible critical current degradation and articles of manufacture in accordance therewith | Feb 21, 2002 | Abandoned |
Array
(
[id] => 6363003
[patent_doc_number] => 20020117329
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-29
[patent_title] => 'Components with releasable leads'
[patent_app_type] => new
[patent_app_number] => 10/058470
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10058470
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/058470 | Components with releasable leads | Jan 27, 2002 | Issued |
Array
(
[id] => 1427243
[patent_doc_number] => 06504108
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-07
[patent_title] => 'Electrical connector having stand-offs between solder balls thereof'
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[patent_app_number] => 10/040347
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[patent_app_date] => 2001-12-28
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[firstpage_image] =>[orig_patent_app_number] => 10040347
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/040347 | Electrical connector having stand-offs between solder balls thereof | Dec 27, 2001 | Issued |
Array
(
[id] => 1210604
[patent_doc_number] => 06713687
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-30
[patent_title] => 'Printed wiring board and method for manufacturing printed wiring board'
[patent_app_type] => B2
[patent_app_number] => 10/022222
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[patent_app_date] => 2001-12-20
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[pdf_file] => patents/06/713/06713687.pdf
[firstpage_image] =>[orig_patent_app_number] => 10022222
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/022222 | Printed wiring board and method for manufacturing printed wiring board | Dec 19, 2001 | Issued |
Array
(
[id] => 1124720
[patent_doc_number] => 06794585
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-09-21
[patent_title] => 'Printed circuit board having filled throughole with corner rounded portion and manufacturing method'
[patent_app_type] => B2
[patent_app_number] => 10/006547
[patent_app_country] => US
[patent_app_date] => 2001-12-04
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/794/06794585.pdf
[firstpage_image] =>[orig_patent_app_number] => 10006547
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/006547 | Printed circuit board having filled throughole with corner rounded portion and manufacturing method | Dec 3, 2001 | Issued |