Brenda H Pham

Array ( [id] => 3773800 [patent_doc_number] => 05817543 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Method of constructing an integrated circuit memory' [patent_app_type] => 1 [patent_app_number] => 8/910873 [patent_app_country] => US [patent_app_date] => 1997-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2698 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 399 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/817/05817543.pdf [firstpage_image] =>[orig_patent_app_number] => 910873 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3877600 [patent_doc_number] => 05804504 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Method for forming wiring of semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/834295 [patent_app_country] => US [patent_app_date] => 1997-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 2179 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804504.pdf [firstpage_image] =>[orig_patent_app_number] => 834295 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3825515 [patent_doc_number] => 05783466 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-21 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/821385 [patent_app_country] => US [patent_app_date] => 1997-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 4043 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/783/05783466.pdf [firstpage_image] =>[orig_patent_app_number] => 821385 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3739118 [patent_doc_number] => 05753537 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-19 [patent_title] => 'Method of manufacturing a semiconductor device for surface mounting' [patent_app_type] => 1 [patent_app_number] => 8/792338 [patent_app_country] => US [patent_app_date] => 1997-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 5357 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 261 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/753/05753537.pdf [firstpage_image] =>[orig_patent_app_number] => 792338 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3785859 [patent_doc_number] => 05840597 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-24 [patent_title] => 'Method of making a semiconductor device force and/or acceleration sensor' [patent_app_type] => 1 [patent_app_number] => 8/789515 [patent_app_country] => US [patent_app_date] => 1997-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3830 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/840/05840597.pdf [firstpage_image] =>[orig_patent_app_number] => 789515 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3841138 [patent_doc_number] => 05707880 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-13 [patent_title] => 'Hermetically sealed radiation imager' [patent_app_type] => 1 [patent_app_number] => 8/785067 [patent_app_country] => US [patent_app_date] => 1997-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2142 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/707/05707880.pdf [firstpage_image] =>[orig_patent_app_number] => 785067 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3727020 [patent_doc_number] => 05702984 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-30 [patent_title] => 'Integrated mulitchip memory module, structure and fabrication' [patent_app_type] => 1 [patent_app_number] => 8/749124 [patent_app_country] => US [patent_app_date] => 1996-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 7136 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/702/05702984.pdf [firstpage_image] =>[orig_patent_app_number] => 749124 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3884364 [patent_doc_number] => 05776802 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-07 [patent_title] => 'Semiconductor device and manufacturing method of the same' [patent_app_type] => 1 [patent_app_number] => 8/741555 [patent_app_country] => US [patent_app_date] => 1996-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 48 [patent_no_of_words] => 9178 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 311 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/776/05776802.pdf [firstpage_image] =>[orig_patent_app_number] => 741555 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3824485 [patent_doc_number] => 05731230 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-24 [patent_title] => 'Method for processing and/or shipping integrated circuit devices' [patent_app_type] => 1 [patent_app_number] => 8/736148 [patent_app_country] => US [patent_app_date] => 1996-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2088 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/731/05731230.pdf [firstpage_image] =>[orig_patent_app_number] => 736148 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3825965 [patent_doc_number] => 05759875 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-02 [patent_title] => 'Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use' [patent_app_type] => 1 [patent_app_number] => 8/725451 [patent_app_country] => US [patent_app_date] => 1996-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3891 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/759/05759875.pdf [firstpage_image] =>[orig_patent_app_number] => 725451 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3968550 [patent_doc_number] => 05904500 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Method for the preparation of lead-on-chip assemblies' [patent_app_type] => 1 [patent_app_number] => 8/724993 [patent_app_country] => US [patent_app_date] => 1996-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2957 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/904/05904500.pdf [firstpage_image] =>[orig_patent_app_number] => 724993 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3825443 [patent_doc_number] => 05783461 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-21 [patent_title] => 'Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication' [patent_app_type] => 1 [patent_app_number] => 8/726349 [patent_app_country] => US [patent_app_date] => 1996-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4783 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/783/05783461.pdf [firstpage_image] =>[orig_patent_app_number] => 726349 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3888903 [patent_doc_number] => 05834335 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/721801 [patent_app_country] => US [patent_app_date] => 1996-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 2711 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834335.pdf [firstpage_image] =>[orig_patent_app_number] => 721801 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3740786 [patent_doc_number] => 05786269 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-28 [patent_title] => 'II-VI group compound semiconductor device and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/719263 [patent_app_country] => US [patent_app_date] => 1996-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 12 [patent_no_of_words] => 5596 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/786/05786269.pdf [firstpage_image] =>[orig_patent_app_number] => 719263 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3888941 [patent_doc_number] => 05834338 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Chip carrier semiconductor device assembly and a method for forming the same' [patent_app_type] => 1 [patent_app_number] => 8/717455 [patent_app_country] => US [patent_app_date] => 1996-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 5572 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834338.pdf [firstpage_image] =>[orig_patent_app_number] => 717455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3785853 [patent_doc_number] => 05736432 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-07 [patent_title] => 'Lead frame with lead finger locking feature and method for making same' [patent_app_type] => 1 [patent_app_number] => 8/717481 [patent_app_country] => US [patent_app_date] => 1996-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3252 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/736/05736432.pdf [firstpage_image] =>[orig_patent_app_number] => 717481 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3740390 [patent_doc_number] => 05786239 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-28 [patent_title] => 'Method of manufacturing a semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/717419 [patent_app_country] => US [patent_app_date] => 1996-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 4806 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/786/05786239.pdf [firstpage_image] =>[orig_patent_app_number] => 717419 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3889419 [patent_doc_number] => 05834370 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Manufacture of semiconductor device containing polycide electrode' [patent_app_type] => 1 [patent_app_number] => 8/705433 [patent_app_country] => US [patent_app_date] => 1996-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 1363 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834370.pdf [firstpage_image] =>[orig_patent_app_number] => 705433 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3875473 [patent_doc_number] => 05747385 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-05 [patent_title] => 'Method of planarizing interlayer dielectric' [patent_app_type] => 1 [patent_app_number] => 8/687843 [patent_app_country] => US [patent_app_date] => 1996-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 21 [patent_no_of_words] => 6416 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/747/05747385.pdf [firstpage_image] =>[orig_patent_app_number] => 687843 [rel_patent_id] =>[rel_patent_doc_number] =>)