Search

Angela Y Ortiz

Examiner (ID: 9995)

Most Active Art Unit
1732
Art Unit(s)
1789, 1307, 2899, 1732, 3663, 1798, 1797
Total Applications
1089
Issued Applications
798
Pending Applications
57
Abandoned Applications
203

Applications

Application numberTitle of the applicationFiling DateStatus
09/014885 METHOD FOR REDUCING VIA INDUCTANCE IN AN ELECTRONIC ASSEMBLY AND ARTICLE Jan 27, 1998 Issued
Array ( [id] => 4060978 [patent_doc_number] => 05864089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-26 [patent_title] => 'Low-crosstalk modular electrical connector assembly' [patent_app_type] => 1 [patent_app_number] => 8/970233 [patent_app_country] => US [patent_app_date] => 1997-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 7787 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 258 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/864/05864089.pdf [firstpage_image] =>[orig_patent_app_number] => 970233 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/970233
Low-crosstalk modular electrical connector assembly Nov 13, 1997 Issued
Array ( [id] => 3764890 [patent_doc_number] => 05844166 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Lattice RF shield' [patent_app_type] => 1 [patent_app_number] => 8/907290 [patent_app_country] => US [patent_app_date] => 1997-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3161 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844166.pdf [firstpage_image] =>[orig_patent_app_number] => 907290 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/907290
Lattice RF shield Aug 5, 1997 Issued
Array ( [id] => 3786477 [patent_doc_number] => 05821457 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Semiconductor die carrier having a dielectric epoxy between adjacent leads' [patent_app_type] => 1 [patent_app_number] => 8/902032 [patent_app_country] => US [patent_app_date] => 1997-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 23 [patent_no_of_words] => 7577 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821457.pdf [firstpage_image] =>[orig_patent_app_number] => 902032 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/902032
Semiconductor die carrier having a dielectric epoxy between adjacent leads Jul 28, 1997 Issued
Array ( [id] => 3988647 [patent_doc_number] => 05959256 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-28 [patent_title] => 'Multilayer printed wiring board' [patent_app_type] => 1 [patent_app_number] => 8/889976 [patent_app_country] => US [patent_app_date] => 1997-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 4669 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/959/05959256.pdf [firstpage_image] =>[orig_patent_app_number] => 889976 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/889976
Multilayer printed wiring board Jul 9, 1997 Issued
Array ( [id] => 3894390 [patent_doc_number] => 05834704 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Pattern structure of flexible printed circuit board' [patent_app_type] => 1 [patent_app_number] => 8/855557 [patent_app_country] => US [patent_app_date] => 1997-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1641 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834704.pdf [firstpage_image] =>[orig_patent_app_number] => 855557 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/855557
Pattern structure of flexible printed circuit board Jun 3, 1997 Issued
Array ( [id] => 3797726 [patent_doc_number] => 05780776 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-14 [patent_title] => 'Multilayer circuit board unit' [patent_app_type] => 1 [patent_app_number] => 8/866315 [patent_app_country] => US [patent_app_date] => 1997-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3043 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/780/05780776.pdf [firstpage_image] =>[orig_patent_app_number] => 866315 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/866315
Multilayer circuit board unit May 29, 1997 Issued
Array ( [id] => 3864356 [patent_doc_number] => 05796049 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Electronics mounting plate with heat exchanger and method for manufacturing same' [patent_app_type] => 1 [patent_app_number] => 8/832998 [patent_app_country] => US [patent_app_date] => 1997-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 3294 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796049.pdf [firstpage_image] =>[orig_patent_app_number] => 832998 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/832998
Electronics mounting plate with heat exchanger and method for manufacturing same Apr 3, 1997 Issued
Array ( [id] => 4040985 [patent_doc_number] => 05856636 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-05 [patent_title] => 'Electronic circuit prototype wiring board with visually distinctive contact pads' [patent_app_type] => 1 [patent_app_number] => 8/810356 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3384 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/856/05856636.pdf [firstpage_image] =>[orig_patent_app_number] => 810356 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/810356
Electronic circuit prototype wiring board with visually distinctive contact pads Mar 2, 1997 Issued
Array ( [id] => 3843489 [patent_doc_number] => 05847326 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability' [patent_app_type] => 1 [patent_app_number] => 8/808019 [patent_app_country] => US [patent_app_date] => 1997-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3669 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847326.pdf [firstpage_image] =>[orig_patent_app_number] => 808019 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/808019
Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability Mar 2, 1997 Issued
Array ( [id] => 3902009 [patent_doc_number] => 05750923 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Electric shielding metal shell receptacle having movable binding strips' [patent_app_type] => 1 [patent_app_number] => 8/792756 [patent_app_country] => US [patent_app_date] => 1997-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1042 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 440 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/750/05750923.pdf [firstpage_image] =>[orig_patent_app_number] => 792756 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/792756
Electric shielding metal shell receptacle having movable binding strips Feb 3, 1997 Issued
Array ( [id] => 3786448 [patent_doc_number] => 05821455 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid' [patent_app_type] => 1 [patent_app_number] => 8/790577 [patent_app_country] => US [patent_app_date] => 1997-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 34 [patent_no_of_words] => 7174 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821455.pdf [firstpage_image] =>[orig_patent_app_number] => 790577 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/790577
Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid Jan 28, 1997 Issued
Array ( [id] => 3797663 [patent_doc_number] => 05780772 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-14 [patent_title] => 'Solution to mold wire sweep in fine pitch devices' [patent_app_type] => 1 [patent_app_number] => 8/788546 [patent_app_country] => US [patent_app_date] => 1997-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3699 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 282 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/780/05780772.pdf [firstpage_image] =>[orig_patent_app_number] => 788546 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/788546
Solution to mold wire sweep in fine pitch devices Jan 23, 1997 Issued
Array ( [id] => 3743881 [patent_doc_number] => 05753857 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-19 [patent_title] => 'Charge coupled device (CCD) semiconductor chip package' [patent_app_type] => 1 [patent_app_number] => 8/785017 [patent_app_country] => US [patent_app_date] => 1997-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1456 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/753/05753857.pdf [firstpage_image] =>[orig_patent_app_number] => 785017 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/785017
Charge coupled device (CCD) semiconductor chip package Jan 16, 1997 Issued
Array ( [id] => 3796239 [patent_doc_number] => 05726391 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-10 [patent_title] => 'Thermosetting Encapsulants for electronics packaging' [patent_app_type] => 1 [patent_app_number] => 8/768056 [patent_app_country] => US [patent_app_date] => 1996-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6481 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/726/05726391.pdf [firstpage_image] =>[orig_patent_app_number] => 768056 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/768056
Thermosetting Encapsulants for electronics packaging Dec 15, 1996 Issued
Array ( [id] => 3819403 [patent_doc_number] => 05789704 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-04 [patent_title] => 'Container with heat removing features for containing an electronic contol unit' [patent_app_type] => 1 [patent_app_number] => 8/753956 [patent_app_country] => US [patent_app_date] => 1996-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 7359 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/789/05789704.pdf [firstpage_image] =>[orig_patent_app_number] => 753956 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/753956
Container with heat removing features for containing an electronic contol unit Dec 2, 1996 Issued
Array ( [id] => 3843503 [patent_doc_number] => 05847327 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Dimensionally stable core for use in high density chip packages' [patent_app_type] => 1 [patent_app_number] => 8/747169 [patent_app_country] => US [patent_app_date] => 1996-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 20 [patent_no_of_words] => 12518 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847327.pdf [firstpage_image] =>[orig_patent_app_number] => 747169 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/747169
Dimensionally stable core for use in high density chip packages Nov 7, 1996 Issued
Array ( [id] => 3855935 [patent_doc_number] => 05767446 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-16 [patent_title] => 'Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/736107 [patent_app_country] => US [patent_app_date] => 1996-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2641 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/767/05767446.pdf [firstpage_image] =>[orig_patent_app_number] => 736107 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/736107
Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package Oct 23, 1996 Issued
Array ( [id] => 3881456 [patent_doc_number] => 05804771 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Organic substrate (PCB) slip plane \"stress deflector\" for flip chip deivces' [patent_app_type] => 1 [patent_app_number] => 8/721268 [patent_app_country] => US [patent_app_date] => 1996-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 1472 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804771.pdf [firstpage_image] =>[orig_patent_app_number] => 721268 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/721268
Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces Sep 25, 1996 Issued
Array ( [id] => 3625613 [patent_doc_number] => 05689089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-18 [patent_title] => 'Electronic control module having fluid-tight seals of a polymer material which expands when wet' [patent_app_type] => 1 [patent_app_number] => 8/717048 [patent_app_country] => US [patent_app_date] => 1996-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3293 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/689/05689089.pdf [firstpage_image] =>[orig_patent_app_number] => 717048 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/717048
Electronic control module having fluid-tight seals of a polymer material which expands when wet Sep 19, 1996 Issued
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