Kyle J Moody
Examiner (ID: 11195, Phone: (571)272-5242 , Office: P/2838 )
Most Active Art Unit | 2838 |
Art Unit(s) | 2838 |
Total Applications | 738 |
Issued Applications | 638 |
Pending Applications | 49 |
Abandoned Applications | 51 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6306764
[patent_doc_number] => 20020094655
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-18
[patent_title] => 'Electric double layer capacitor and method of forming the same'
[patent_app_type] => new
[patent_app_number] => 09/987923
[patent_app_country] => US
[patent_app_date] => 2001-11-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 16223
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[patent_words_short_claim] => 67
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0094/20020094655.pdf
[firstpage_image] =>[orig_patent_app_number] => 09987923
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/987923 | Electric double layer capacitor and method of forming the same | Nov 15, 2001 | Abandoned |
Array
(
[id] => 1303141
[patent_doc_number] => 06616713
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-09
[patent_title] => 'Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method'
[patent_app_type] => B2
[patent_app_number] => 09/987251
[patent_app_country] => US
[patent_app_date] => 2001-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 7968
[patent_no_of_claims] => 22
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/616/06616713.pdf
[firstpage_image] =>[orig_patent_app_number] => 09987251
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/987251 | Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method | Nov 13, 2001 | Issued |
Array
(
[id] => 7628813
[patent_doc_number] => 06819546
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-16
[patent_title] => 'Packaged solid electrolytic capacitor and method of making the same'
[patent_app_type] => B2
[patent_app_number] => 10/008934
[patent_app_country] => US
[patent_app_date] => 2001-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 73
[patent_figures_cnt] => 157
[patent_no_of_words] => 20633
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/819/06819546.pdf
[firstpage_image] =>[orig_patent_app_number] => 10008934
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/008934 | Packaged solid electrolytic capacitor and method of making the same | Nov 8, 2001 | Issued |
Array
(
[id] => 6618151
[patent_doc_number] => 20020064908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-30
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 09/986051
[patent_app_country] => US
[patent_app_date] => 2001-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5758
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0064/20020064908.pdf
[firstpage_image] =>[orig_patent_app_number] => 09986051
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/986051 | Semiconductor device and method of manufacturing the same | Nov 6, 2001 | Issued |
Array
(
[id] => 1258398
[patent_doc_number] => 06667787
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-23
[patent_title] => 'Polarizer'
[patent_app_type] => B2
[patent_app_number] => 09/984514
[patent_app_country] => US
[patent_app_date] => 2001-10-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 6322
[patent_no_of_claims] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/667/06667787.pdf
[firstpage_image] =>[orig_patent_app_number] => 09984514
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/984514 | Polarizer | Oct 29, 2001 | Issued |
Array
(
[id] => 6539177
[patent_doc_number] => 20020137269
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-26
[patent_title] => 'Method for forming raised structures by controlled selective epitaxial growth of facet using spacer'
[patent_app_type] => new
[patent_app_number] => 10/046497
[patent_app_country] => US
[patent_app_date] => 2001-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 5246
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[pdf_file] => publications/A1/0137/20020137269.pdf
[firstpage_image] =>[orig_patent_app_number] => 10046497
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/046497 | Method for forming raised structures by controlled selective epitaxial growth of facet using spacer | Oct 25, 2001 | Abandoned |
Array
(
[id] => 5967610
[patent_doc_number] => 20020090484
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-11
[patent_title] => 'Plating bath'
[patent_app_type] => new
[patent_app_number] => 09/981852
[patent_app_country] => US
[patent_app_date] => 2001-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4201
[patent_no_of_claims] => 13
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0090/20020090484.pdf
[firstpage_image] =>[orig_patent_app_number] => 09981852
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/981852 | Plating bath | Oct 16, 2001 | Abandoned |
Array
(
[id] => 1346466
[patent_doc_number] => 06583039
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-06-24
[patent_title] => 'Method of forming a bump on a copper pad'
[patent_app_type] => B2
[patent_app_number] => 09/978422
[patent_app_country] => US
[patent_app_date] => 2001-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 26
[patent_no_of_words] => 4945
[patent_no_of_claims] => 18
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[patent_words_short_claim] => 240
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/583/06583039.pdf
[firstpage_image] =>[orig_patent_app_number] => 09978422
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/978422 | Method of forming a bump on a copper pad | Oct 14, 2001 | Issued |
Array
(
[id] => 1387264
[patent_doc_number] => 06555914
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-29
[patent_title] => 'Integrated circuit package via'
[patent_app_type] => B1
[patent_app_number] => 09/975871
[patent_app_country] => US
[patent_app_date] => 2001-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555914.pdf
[firstpage_image] =>[orig_patent_app_number] => 09975871
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/975871 | Integrated circuit package via | Oct 11, 2001 | Issued |
Array
(
[id] => 1340282
[patent_doc_number] => 06589887
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-08
[patent_title] => 'Forming metal-derived layers by simultaneous deposition and evaporation of metal'
[patent_app_type] => B1
[patent_app_number] => 09/975612
[patent_app_country] => US
[patent_app_date] => 2001-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 5320
[patent_no_of_claims] => 25
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/589/06589887.pdf
[firstpage_image] =>[orig_patent_app_number] => 09975612
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/975612 | Forming metal-derived layers by simultaneous deposition and evaporation of metal | Oct 10, 2001 | Issued |
Array
(
[id] => 6643492
[patent_doc_number] => 20030007316
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-09
[patent_title] => 'Electric double layer capacitor and method for producing the same'
[patent_app_type] => new
[patent_app_number] => 09/975194
[patent_app_country] => US
[patent_app_date] => 2001-10-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0007/20030007316.pdf
[firstpage_image] =>[orig_patent_app_number] => 09975194
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/975194 | Method of producing electrical double layer capacitor and method of mounting electrical double layer capacitor on a circuit substrate | Oct 9, 2001 | Issued |
Array
(
[id] => 1257319
[patent_doc_number] => 06667536
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-23
[patent_title] => 'Thin film multi-layer high Q transformer formed in a semiconductor substrate'
[patent_app_type] => B2
[patent_app_number] => 09/972481
[patent_app_country] => US
[patent_app_date] => 2001-10-05
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/667/06667536.pdf
[firstpage_image] =>[orig_patent_app_number] => 09972481
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/972481 | Thin film multi-layer high Q transformer formed in a semiconductor substrate | Oct 4, 2001 | Issued |
Array
(
[id] => 6834236
[patent_doc_number] => 20030161781
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-28
[patent_title] => 'Novel carbon materials and carbon/carbon composites based on modified poly (phenylene ether) for energy production and storage devices, and methods of making them'
[patent_app_type] => new
[patent_app_number] => 09/968290
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0161/20030161781.pdf
[firstpage_image] =>[orig_patent_app_number] => 09968290
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/968290 | Novel carbon materials and carbon/carbon composites based on modified poly (phenylene ether) for energy production and storage devices, and methods of making them | Sep 30, 2001 | Abandoned |
Array
(
[id] => 6674434
[patent_doc_number] => 20030060037
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-27
[patent_title] => 'Method of manufacturing trench conductor line'
[patent_app_type] => new
[patent_app_number] => 09/967712
[patent_app_country] => US
[patent_app_date] => 2001-09-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0060/20030060037.pdf
[firstpage_image] =>[orig_patent_app_number] => 09967712
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/967712 | Method of manufacturing trench conductor line | Sep 26, 2001 | Abandoned |
Array
(
[id] => 6617163
[patent_doc_number] => 20020016057
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-07
[patent_title] => 'Fill material for dual damascene processes'
[patent_app_type] => new
[patent_app_number] => 09/966208
[patent_app_country] => US
[patent_app_date] => 2001-09-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0016/20020016057.pdf
[firstpage_image] =>[orig_patent_app_number] => 09966208
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/966208 | Fill material for dual damascene processes | Sep 26, 2001 | Abandoned |
Array
(
[id] => 1239703
[patent_doc_number] => 06686273
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-02-03
[patent_title] => 'Method of fabricating copper interconnects with very low-k inter-level insulator'
[patent_app_type] => B2
[patent_app_number] => 09/965582
[patent_app_country] => US
[patent_app_date] => 2001-09-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/686/06686273.pdf
[firstpage_image] =>[orig_patent_app_number] => 09965582
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/965582 | Method of fabricating copper interconnects with very low-k inter-level insulator | Sep 25, 2001 | Issued |
Array
(
[id] => 6409267
[patent_doc_number] => 20020182850
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Interconnect structure manufacturing process'
[patent_app_type] => new
[patent_app_number] => 09/960982
[patent_app_country] => US
[patent_app_date] => 2001-09-25
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09960982
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/960982 | Interconnect structure manufacturing process | Sep 24, 2001 | Abandoned |
Array
(
[id] => 1412569
[patent_doc_number] => 06524943
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-25
[patent_title] => 'Method of forming metal bumps'
[patent_app_type] => B1
[patent_app_number] => 09/961351
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[pdf_file] => patents/06/524/06524943.pdf
[firstpage_image] =>[orig_patent_app_number] => 09961351
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/961351 | Method of forming metal bumps | Sep 24, 2001 | Issued |
Array
(
[id] => 993625
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[patent_issue_date] => 2005-07-12
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
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[patent_app_date] => 2001-09-20
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[pdf_file] => patents/06/916/06916724.pdf
[firstpage_image] =>[orig_patent_app_number] => 09956461
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/956461 | Semiconductor device and method for manufacturing the same | Sep 19, 2001 | Issued |
Array
(
[id] => 5859345
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[patent_issue_date] => 2002-09-05
[patent_title] => 'Method of forming a via of a dual damascene with low resistance'
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[patent_app_number] => 09/682481
[patent_app_country] => US
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[pdf_file] => publications/A1/0123/20020123219.pdf
[firstpage_image] =>[orig_patent_app_number] => 09682481
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/682481 | Method of forming a via of a dual damascene with low resistance | Sep 6, 2001 | Abandoned |