Cu film deposition equipment of semiconductor device | Patent Publication Number 20040092101

US 20040092101 A1

Patent NumberUS 06855632 B2

Application Number10697320

Filled DateOct 31, 2003

Priority DateMay 30, 2002

Publication DateMay 13, 2004

Original AssigneeSk Group

Current AssigneeSk Group

Inventor/ApplicantsSi Bum Kim
Si Bum Kim
Sung Gyu Pyo
Sung Gvu Pyo

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