Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | Patent Publication Number 20060141386

US 20060141386 A1
Patent NumberUS 07169532 B2
Application Number11025589
Filled DateDec 29, 2004
Priority DateDec 29, 2004
Publication DateJun 29, 2006
Original AssigneeTokyo Ohka Kogyo Co. Ltd.
Current AssigneeTokyo Ohka Kogyo Co. Ltd.
Inventor/ApplicantsKoji Saito
Koichi Misumi
Toshiki Okui
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