HEAT-RESISTANT COPPER FOIL AND METHOD OF PRODUCING THE SAME, CIRCUIT BOARD, AND COPPER-CLAD LAMINATE AND METHOD OF PRODUCING THE SAME | Patent Publication Number 20120205146

US 20120205146 A1
Patent Number-
Application Number13390403
Filled DateAug 11, 2010
Priority DateAug 11, 2010
Publication DateAug 16, 2012
Original AssigneeFurukawa Co. Ltd.
Current AssigneeFurukawa Electric Co. Ltd.
Inventor/ApplicantsKazuhiro Hoshino
Ryoichi Oguro
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