Method of manufacturing a circuit board | Patent Publication Number 20130227838

US 20130227838 A1

Patent NumberUS 08673391 B2

Application Number13859421

Filled DateApr 9, 2013

Priority DateAug 15, 2003

Publication DateSep 5, 2013

Original AssigneeIntel Corporation

Current AssigneeIntel Corporation

Inventor/ApplicantsDavid Shykind
James A. McCall
James McCall

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