Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same | Patent Publication Number 20130270218
US 20130270218 A1Publication DateOct 17, 2013
Original Assignee
Current AssigneeJx Nippon Mining & Metals Corporation Jxtg
Inventor/ApplicantsKeisuke Yamanishi
Ryo Fukuchi
Kengo Kaminaga
Ryo Fukuchi
Kengo Kaminaga
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