Method of stressing a semiconductor layer | Patent Publication Number 20150118823

US 20150118823 A1

Patent NumberUS 09318372 B2

Application Number14526053

Filled DateOct 28, 2014

Priority DateOct 28, 2014

Publication DateApr 30, 2015

Original AssigneeStmicroelectronics

Current AssigneeStmicroelectronics

Inventor/ApplicantsPierre Morin
Olivier Nier
Emmanuel Josse
Denis Rideau

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