Method of forming stressed SOI layer | Patent Publication Number 20150118824

US 20150118824 A1

Patent NumberUS 09305828 B2

Application Number14526005

Filled DateOct 28, 2014

Priority DateOct 28, 2014

Publication DateApr 30, 2015

Original AssigneeStmicroelectronics

Current AssigneeStmicroelectronics

Inventor/ApplicantsOlivier Nier
Denis Rideau
Emmanuel Josse

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