Semiconductor device design methods and conductive bump pattern enhancement methods | Patent Publication Number 20150143324
US 20150143324 A1Patent NumberUS 09372951 B2
Application Number14084813
Filled DateNov 20, 2013
Priority DateNov 20, 2013
Publication DateMay 21, 2015
Original AssigneeTaiwan Semiconductor Manufacturing Company
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsTzu-Yu Wang
Shang-Yun Hou
Shin-Puu Jeng
Kuo-Ching Hsu
Wei-Cheng Wu
Shang-Yun Hou
Shin-Puu Jeng
Kuo-Ching Hsu
Wei-Cheng Wu
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