Semiconductor device design methods and conductive bump pattern enhancement methods | Patent Publication Number 20160283639

US 20160283639 A1
Patent NumberUS 09760670 B2
Application Number15174795
Filled DateJun 6, 2016
Priority DateNov 20, 2013
Publication DateSep 29, 2016
Original AssigneeTaiwan Semiconductor Manufacturing Company
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsShin-Puu Jeng
Wei-Cheng Wu
Shang-Yun Hou
Tzu-Yu Wang
Kuo-Ching Hsu
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