Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | Patent Publication Number 20170332487

US 20170332487 A1
Patent NumberUS 09999126 B2
Application Number15525442
Filled DateJan 29, 2016
Priority DateJan 29, 2016
Publication DateNov 16, 2017
Original AssigneeMitsubishi Electric Corporation
Current AssigneeMitsubishi Gaschemical Company Inc.
Inventor/ApplicantsKentaro Takano
Takashi Kobayashi
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