Electromigration Improvement Using Tungsten For Selective Cobalt Deposition On Copper Surfaces | Patent Publication Number 20180144973
US 20180144973 A1Publication DateMay 24, 2018
Original Assignee
Current AssigneeApplied Materials Israel
Inventor/ApplicantsKai Wu
Keyvan Kashefizadeh
Vikash Banthia
Sang Ho Yu
Feiyue Ma
Hua Ai
Yu Lei
Jiang Lu
He Ren
Kevin Moraes
Weifeng Ye
Zhiyuan Wu
Mei Chang
Feng Chen
Paul F. Ma
Keyvan Kashefizadeh
Vikash Banthia
Sang Ho Yu
Feiyue Ma
Hua Ai
Yu Lei
Jiang Lu
He Ren
Kevin Moraes
Weifeng Ye
Zhiyuan Wu
Mei Chang
Feng Chen
Paul F. Ma
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