Chemical mechanical polishing apparatus and method | Patent Publication Number 20190099854
US 20190099854 A1Patent NumberUS 10967478 B2
Application Number16031899
Filled DateJul 10, 2018
Priority DateSep 29, 2017
Publication DateApr 4, 2019
Original AssigneeTaiwan Semiconductor Manufacturing Company
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsKei-Wei Chen
Shich-Chang Suen
Liang-Guang Chen
Shich-Chang Suen
Liang-Guang Chen
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