Method for forming semiconductor devices | Patent Publication Number 20190275638

US 20190275638 A1

Patent NumberUS 10710210 B2

Application Number16424595

Filled DateMay 29, 2019

Priority DateJul 20, 2017

Publication DateSep 12, 2019

Original AssigneeInfineon Technologies Ag

Current AssigneeInfineon Technologies Ag

Inventor/ApplicantsRudolf Lehner

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