Mobility robustness and spatial reliability using multi-connectivity | Patent Publication Number 20190387561

US 20190387561 A1
Patent NumberUS 11330653 B2
Application Number16440220
Filled DateJun 13, 2019
Priority DateJun 14, 2018
Publication DateDec 19, 2019
Original AssigneeQualcomm Technologies Inc.
Current AssigneeQualcomm Technologies Inc.
Inventor/ApplicantsKeiichi Kubota
Gavin Bernard Horn
Yu-Ting Yu
Karthika Paladugu
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