Fan-out sensor package | Patent Publication Number 20200328241

US 20200328241 A1
Patent NumberUS 10998362 B2
Application Number16915274
Filled DateJun 29, 2020
Priority DateSep 17, 2018
Publication DateOct 15, 2020
Original AssigneeSamsung Electronics
Current AssigneeSamsung Electronics
Inventor/ApplicantsJae Hyun LIM
Kyung Moon JUNG
Kyung Moon Jung
Yoon Seok SEO
Eun Jin KIM
Jae Hyun Lim
Eun Jin Kim
Yoon Seok Seo
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