Integrated Fan-Out Package with 3D Magnetic Core Inductor | Patent Publication Number 20210193572

US 20210193572 A1
Patent Number-
Application Number17174617
Filled DateFeb 12, 2021
Priority DateApr 26, 2017
Publication DateJun 24, 2021
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsChewn-Pu Jou
Chen-Hua Yu
Feng Wei Kuo
Wen-Shiang Liao
Chih-Hang Tung
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