Method of manufacturing semiconductor device | Patent Publication Number 20210210356

US 20210210356 A1
Patent NumberUS 11990347 B2
Application Number17142140
Filled DateJan 5, 2021
Priority DateJan 5, 2021
Publication DateJul 8, 2021
Original AssigneeKokusai Electric Co. Ltd.
Current AssigneeKokusai Electric Co. Ltd.
Inventor/ApplicantsToshiyuki KIKUCHI
Takashi YAHATA
Toshiyuki Kikuchi
Takashi Yahata
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