High power module package structures | Patent Publication Number 20210351101

US 20210351101 A1
Patent NumberUS 11810775 B2
Application Number17443307
Filled DateJul 23, 2021
Priority DateMay 2, 2018
Publication DateNov 11, 2021
Original AssigneeOnsemi
Current AssigneeSemiconductor Components Industries
Inventor/ApplicantsYusheng Lin
Jerome TEYSSEYRE
Jerome Teysseyre
Yusheng LIN
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