INTEGRATED THERMOELECTRIC DEVICE TO MITIGATE INTEGRATED CIRCUIT HOT SPOTS | Patent Publication Number 20230091603

US 20230091603 A1
Patent Number-
Application Number17481501
Filled DateSep 22, 2021
Priority DateSep 22, 2021
Publication DateMar 23, 2023
Original AssigneeIntel Corporation
Current AssigneeIntel Corporation
Inventor/ApplicantsAbhishek Anil Sharma
Hui Jae Yoo
Van H. Le
Noriyuki Sato
Kevin L. Lin
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