METHOD FOR IMPROVING THE SURFACE ROUGHNESS OF A SILICON-ON-INSULATOR WAFER | Patent Publication Number 20230137992

US 20230137992 A1
Patent Number-
Application Number17585557
Filled DateJan 27, 2022
Priority DateJan 27, 2022
Publication DateMay 4, 2023
Original AssigneeShanghai Institute Of Microsystem And Information Technology
Current AssigneeShanghai Institute Of Microsystem And Information Technology
Inventor/ApplicantsZi Wen Wang
Rong Wang Dai
Zhong Ying Xue
Xing Wei
Ming Hao Li
Hong Tao Xu
Meng Chen
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