THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METHOD AND METHOD OF PRODUCING THIN-FILM | Patent Publication Number 20230151220
US 20230151220 A1Publication DateMay 18, 2023
Original AssigneeAdeka Corporation
Current AssigneeAdeka Corporation
Inventor/ApplicantsKeisuke TAKEDA
Masaki ENZU
Masaki ENZU
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