Printed Circuit Board, Power Semiconductor Module Arrangement Comprising a Printed Circuit Board, and Method for Assembling the Same | Patent Publication Number 20230238314
US 20230238314 A1Publication DateJul 27, 2023
Original Assignee
Current AssigneeInfineon Technologies Ag
Inventor/ApplicantsGuido Bonig
Sebastian Michalski
Sebastian Michalski
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