DUAL METAL CAPPED VIA CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES | Patent Publication Number 20230261070

US 20230261070 A1

Patent Number-

Application Number18305636

Filled DateApr 24, 2023

Priority DateNov 22, 2019

Publication DateAug 17, 2023

Original AssigneeTaiwan Semiconductor Manufacturing Company

Current AssigneeTaiwan Semiconductor Manufacturing Company

Inventor/ApplicantsZiwei Fang
Chung-Liang CHENG

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