Flexible interconnect circuits and methods of fabrication thereof | Patent Publication Number 20230269870

US 20230269870 A1
Patent NumberUS 11751328 B1
Application Number18172781
Filled DateFeb 22, 2023
Priority DateFeb 22, 2022
Publication DateAug 24, 2023
Original AssigneeCellink Corporation
Current AssigneeCitibank N. A.
Inventor/ApplicantsWill Findlay
Casey Anderson
Mark Terlaak
Jean-Paul Ortiz
Malcom Parker Brown
Kevin Michael Coakley
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