FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF | Patent Publication Number 20230371174

US 20230371174 A1
Patent Number-
Application Number18351437
Filled DateJul 12, 2023
Priority DateFeb 22, 2022
Publication DateNov 16, 2023
Original AssigneeCellink Corporation
Current AssigneeCitibank N. A.
Inventor/ApplicantsKevin Michael Coakley
Mark Terlaak
Jean-Paul Ortiz
Casey Anderson
Will Findlay
Malcom Parker Brown
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