PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Patent Publication Number 20230378040
US 20230378040 A1Publication DateNov 23, 2023
Original AssigneeTaiwan Semiconductor Manufacturing Company
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsPei-Hsuan Lee
Chien-Ling Hwang
Chia-Hung Liu
Ching-Hua Hsieh
Sung-Yueh Wu
Jen-Chun Liao
Chien-Ling Hwang
Chia-Hung Liu
Ching-Hua Hsieh
Sung-Yueh Wu
Jen-Chun Liao
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