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Patent Known References
| Type | Patent Country | Patent Number |
|---|---|---|
| Patent | JP | H02134860 |
| Patent | WO | 1995019642 |
| Patent | US | 5579207 |
| Patent | US | 5495394 |
| Patent | DE | 19516487A |
| Patent | DE | 1981323U |
| Patent | DE | 1981624U |
| Patent | DE | 4314913A |
| Patent | DE | 4430812C1 |
| Patent | DE | 4433846A1 |
| Patent | EP | 0531723A1 |
| Patent | EP | 0559366A1 |
| Patent | EP | 0926726A1 |
| Patent | JP | S63156348A |
| Patent | JP | S63213943A |
| Patent | US | 4924589 |
| Patent | US | 4939568 |
| Patent | US | 4954875 |
| Patent | US | 5087585 |
| Patent | US | 5104820 |
| Patent | US | 5208178 |
| Patent | US | 5244818 |
| Patent | US | 5258318 |
| Patent | US | 5270261 |
| Patent | US | 5276338 |
| Patent | US | 5324678 |
| Patent | US | 5324687 |
| Patent | US | 5380681 |
| Patent | US | 5391257 |
| Patent | US | 5426072 |
| Patent | US | 5442236 |
| Patent | US | 5476810 |
| Patent | US | 5489554 |
| Patent | US | 5563084 |
| Patent | US | 5627106 |
| Patent | US | 5767001 |
| Patent | US | 5846879 |
| Patent | US | 5851894 |
| Patent | US | 5877034 |
| Patent | US | 5902118 |
| Patent | US | 6187652 |
| Patent | US | 6294829 |
Published Known References
| Type | Title of NPL |
|---|---|
| Journal | "Sailer Philip; Singhal Piyush; et al. ""Creating 3D circuits using transferred films"". IEEE Circuits and Devices. November 1997" |
| Journal | Akasaka et al. Solid State Technology (Feb. 1989). |
| Journal | "Akasaka Y. ""Three-Dimensional IC Trends"" Proceedings of the IEEE vol. 74 No. 12 Dec. 1986 pp. 1703-1714." |
| Journal | "Hayashi Y. et al. ""Cumulatively Bonded IC (Cubic) Technology For 3D-IC Fabrication"" 8th International Workshop on Future Electron Devices Mar. 14-16 1990 pp. 85-88." |
| Journal | "Kuhn Stefan A. et al. ""Interconnect Capacitances Crosstalk and Signal Delay in Vertically Integrated Circuits"" IDEM 95-249 10.3.1 Siemens AG Corporate R&D Institute for Integrated Cirusits Fraunhofer Institute for Solid State Technology." |
| Journal | Tewksbury et al. IEEE Circuits and Devices Magazine (Sep.1989). |
