CONTEST
Competed$7,000
This contest is closed.
Problem
Patexia seeks prior art for TW Patent 508284 B with a focus on its claims 3 & 4 and TW Patent 528646 B with a focus on its claims 4, 5 & 6.
With respect to ‘284 and ‘646 patent, Patexia is looking for a polishing pad comprising a polishing layer with specific mechanical properties and surface specifications. Such a polishing pad is usually used for the Chemical-Mechanical Planarization/Polishing (CMP) of silicon (or other semiconductor materials) wafers.
Patents are in the same family as the following US patents (for further reading):
- US6,454,634
- US6,582,283
- US6,736,709
- US6,749,485
- US6,860,802
Submitted documents describing this system must be:
● filed or published before 05/27/2000
Questions
# | Question | Value |
---|---|---|
1 | Is the reference either a US patent filed, a foreign patent published, or a non-patent document published before May 27th, 2000? | T/F |
2 | Does the reference describe a polishing pad for the surface planarization of a semiconductor device (such as a wafer) comprising a hydrolytically stable polishing layer? | 15 |
3 | Does the polishing layer have a tensile Modulus of 100-2,000 MPa at 40°C? | 25 |
4 | Does the polishing layer have an Energy Loss Factor (KEL) of 125-850 (1/Pa at 40°C.)? | 25 |
5 | Does the polishing layer have an Elastic Storage Modulus (E′, ratio) of about 1-5 at 30°C to 90°C? | 10 |
6 | Does the polishing layer have a macro-texture comprising one or multiple grooves? | 25 |
Additional Notes
Prior Art Search
This is a Prior Art Search contest aimed at determining if a patent idea was known and publicly available before a patent was filed.
+5 bonus points will be awarded for non-patent literature and for foreign language references.
This contest will close on Sunday, June 10th, 2018 at 11:59 PM PT.
Please review the Contest Rules. For more information on how to submit to this Contest type, please read the Intro to Prior Art Search page.