Wafer Polishing Pads Known References

Type	Patent Country	Patent Number
Patent	DE	60109601
Patent	DE	60114183
Patent	EP	806267
Patent	EP	1284841
Patent	EP	1284842
Patent	GB	969535
Patent	GB	1298204
Patent	JP	2232173
Patent	JP	4615813
Patent	JP	4959901
Patent	JP	5016576
Patent	JP	5544381
Patent	JP	5584666
Patent	JP	5672016
Patent	JP	5767280
Patent	JP	5993360
Patent	JP	6141359
Patent	JP	2004507076
Patent	JP	2004507077
Patent	JP	2009033193
Patent	JP	2012023387
Patent	JP	2012114454
Patent	JP	2013239737
Patent	JP	2014078723
Patent	JP	2015092610
Patent	JP	2015188108
Patent	JP	2017063211
Patent	KR	100571449
Patent	KR	100770852
Patent	KR	20030004421
Patent	KR	20030005405
Patent	SG	43335
Patent	TW	508284
Patent	TW	528646
Patent	US	2701192
Patent	US	3057809
Patent	US	3214491
Patent	US	4824891
Patent	US	4885206
Patent	US	5081051
Patent	US	5212910
Patent	US	5391258
Patent	US	5489233
Patent	US	5578362
Patent	US	5622535
Patent	US	5692950
Patent	US	5921855
Patent	US	6017265
Patent	US	6022268
Patent	US	6454634
Patent	US	6582283
Patent	US	6736709
Patent	US	6749485
Patent	US	6764574
Patent	US	6860802
Patent	US	6910942
Patent	US	7045573
Patent	US	7052365
Patent	US	7226345
Patent	US	2003027500
Patent	US	2005020082
Patent	WO	1989007123
Patent	WO	1996015887
Patent	WO	2001091971
Patent	WO	2001091972

Published Known References

Type	Title of NPL
Other	ISO 6721-1
Other	ISO 6721-4
Other	ASTM D5418-07
Other	ASTM D618
Other	C Wong et al the research report issued by David Taylor Research Center US Navy on January 1990
Other	David C Ponte s master thesis titled Mechanics Framework of Pad Scratching in Chemical-Mechanical Planarization 2015
Other	Grant & Hackh s Chemical Dictionary 1998
Other	H S Lee et al Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes Precision Engineering 37 (2013) pages 483-490
Other	Irene Li et al Dynamic Mechanical Analysis of CMP Pad Materials) Material Research Society Symposium 2000
Other	Irene Li et al Mechanistic Aspects of the Relationship Between CMP Consumables & Polishing Characteristics presented at symposium of Material Research Society April 26 27 2000
Other	J M Hogan C J Pearson T H Rogers and J R White Humidity characteristics of HR and Hot Urethane Foams published on 1973
Other	Jaehyun Bae et al published in the International Conference on Planarization/CMP Technology November 19-21 2009
Other	Jaehyun Bae et al Effect of Retainer Pressure on Removal Profile and Stress Distribution in Oxide CMP International Conference on Planarization CMP Technology November 19-21 2009
Other	James W Bryant Jr s master dissertation titled Prediction of Linear Viscoelastic Response of The Loss Shear Modulus of Polymer-Modified Binders published on March 1999
Other	Japanese Patent Application No 2232173
Other	John J Aklonis and William J MacKnight Introduction to Polymer Viscoelasticity second edition John Wiley and Sons 1983
Other	Joseph M Steigerwald Shyam P Murarka and Ronald J Gutmann Chemical Mechanical Planarization of Microelectronic Materials John Wiley and Sons 1997
Other	Marino Xanthos Functional Fillers for Plastics 2010
Other	Richard L Clark Jr s PhD dissertation titled Influence of the Interphase on the Mechanical Properties of Nylon 66 Composites published on August 1996
Other	Robert L Geimer et al Resin Characterization published on April 3-5 1990 at Proceedings of the 24th WSU International particleboard/composite materials symposium
Other	Rodel s IC 1000 product brochure released in January 1993
Other	Rodel s product brochure for Rodel 1000 CMP Pad published in 1999
Other	Rodel s product brochure in 1992 Suba IV polishing pad
Other	Rodel s product brochure of IC1000 and IC60 polishing pads in 1991
Other	Rodel s product brochure of IC1000 polishing pad in 1991
Other	Rodel s SUBA IV polishing pad product brochure 1992
Other	Sanha Kimet al Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties ECS Journal of Solid State Science and Technology 3(5)P169-P178 (2014)
Other	Takafumi Yoshida Three- Dimensional Wafer Process Model for Nanotopography Mat Res Soc Symp Proc Vol 767 2003 F1 1
Other	Weidan Li Dong Wook Shin Minoru Tomozawa and Shyam P Muraka The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 films Thin Solid Films 270 (1995) 601-606