Abbas I. Abdulselam

Array ( [id] => 18338405 [patent_doc_number] => 20230130354 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DEVICE [patent_app_type] => utility [patent_app_number] => 17/512109 [patent_app_country] => US [patent_app_date] => 2021-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8579 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17512109 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18797030 [patent_doc_number] => 11830865 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-28 [patent_title] => Semiconductor device with redistribution structure and method for fabricating the same [patent_app_type] => utility [patent_app_number] => 17/510878 [patent_app_country] => US [patent_app_date] => 2021-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 10393 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 292 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17510878 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18608184 [patent_doc_number] => 11749662 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-05 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/505040 [patent_app_country] => US [patent_app_date] => 2021-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 15538 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505040 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17373826 [patent_doc_number] => 20220028878 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-27 [patent_title] => SEMICONDUCTOR DEVICES INCLUDING A CONTACT STRUCTURE THAT CONTACTS A DUMMY CHANNEL STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/495320 [patent_app_country] => US [patent_app_date] => 2021-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7339 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495320 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20612659 [patent_doc_number] => 12588276 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Logic cell structure with diffusion box [patent_app_type] => utility [patent_app_number] => 17/487477 [patent_app_country] => US [patent_app_date] => 2021-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 2433 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17487477 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18593407 [patent_doc_number] => 11742319 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Method of manufacturing electronic device [patent_app_type] => utility [patent_app_number] => 17/482438 [patent_app_country] => US [patent_app_date] => 2021-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 14 [patent_no_of_words] => 8442 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17482438 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17723450 [patent_doc_number] => 20220216172 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-07 [patent_title] => ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/477655 [patent_app_country] => US [patent_app_date] => 2021-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11814 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17477655 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19704895 [patent_doc_number] => 12198942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-14 [patent_title] => Packaging structure and method for preparing same [patent_app_type] => utility [patent_app_number] => 17/478806 [patent_app_country] => US [patent_app_date] => 2021-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 3767 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 302 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17478806 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17886572 [patent_doc_number] => 20220302050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING NEIGHBORING DIE CONTACT AND SEAL RING STRUCTURES, AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/474327 [patent_app_country] => US [patent_app_date] => 2021-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7967 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17474327 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19828771 [patent_doc_number] => 12249563 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-11 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/473481 [patent_app_country] => US [patent_app_date] => 2021-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 12035 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473481 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17900877 [patent_doc_number] => 20220310539 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-29 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/470667 [patent_app_country] => US [patent_app_date] => 2021-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7088 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17470667 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19277379 [patent_doc_number] => 12027512 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Chipset and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/468687 [patent_app_country] => US [patent_app_date] => 2021-09-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 17 [patent_no_of_words] => 5721 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 364 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17468687 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19524021 [patent_doc_number] => 12125761 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => Semiconductor package including package seal ring and methods for forming the same [patent_app_type] => utility [patent_app_number] => 17/467658 [patent_app_country] => US [patent_app_date] => 2021-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 30 [patent_no_of_words] => 12125 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17467658 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18137454 [patent_doc_number] => 11563144 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-24 [patent_title] => Advanced electronic device structures using semiconductor structures and superlattices [patent_app_type] => utility [patent_app_number] => 17/446926 [patent_app_country] => US [patent_app_date] => 2021-09-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 41 [patent_figures_cnt] => 61 [patent_no_of_words] => 15353 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17446926 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17840704 [patent_doc_number] => 20220278010 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-01 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP [patent_app_type] => utility [patent_app_number] => 17/464002 [patent_app_country] => US [patent_app_date] => 2021-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6727 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17464002 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19260991 [patent_doc_number] => 12021057 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-25 [patent_title] => Semiconductor structure and semiconductor die [patent_app_type] => utility [patent_app_number] => 17/462021 [patent_app_country] => US [patent_app_date] => 2021-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 41 [patent_figures_cnt] => 41 [patent_no_of_words] => 8551 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462021 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19376680 [patent_doc_number] => 12068260 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-20 [patent_title] => Semiconductor die package with ring structure and method for forming the same [patent_app_type] => utility [patent_app_number] => 17/462431 [patent_app_country] => US [patent_app_date] => 2021-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7526 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462431 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19858251 [patent_doc_number] => 12261102 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Semiconductor package and method of forming the same [patent_app_type] => utility [patent_app_number] => 17/461941 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 13450 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461941 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20441563 [patent_doc_number] => 12512405 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-30 [patent_title] => Semiconductor package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/460339 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 23 [patent_no_of_words] => 4289 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 331 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17460339 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18225283 [patent_doc_number] => 20230064277 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH REINFORCING STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/461391 [patent_app_country] => US [patent_app_date] => 2021-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9217 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17461391 [rel_patent_id] =>[rel_patent_doc_number] =>)