Search

Abbigale A. Boyle

Examiner (ID: 6386, Phone: (571)270-7919 , Office: P/2816 )

Most Active Art Unit
2816
Art Unit(s)
2899, 2891, 2816
Total Applications
419
Issued Applications
231
Pending Applications
66
Abandoned Applications
139

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10270250 [patent_doc_number] => 20150155247 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-04 [patent_title] => 'BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE' [patent_app_type] => utility [patent_app_number] => 14/546734 [patent_app_country] => US [patent_app_date] => 2014-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8101 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14546734 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/546734
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE Nov 17, 2014 Abandoned
Array ( [id] => 12109034 [patent_doc_number] => 09865522 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-01-09 [patent_title] => 'Composite heat sink structures' [patent_app_type] => utility [patent_app_number] => 14/546136 [patent_app_country] => US [patent_app_date] => 2014-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 31 [patent_no_of_words] => 11488 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14546136 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/546136
Composite heat sink structures Nov 17, 2014 Issued
Array ( [id] => 10370421 [patent_doc_number] => 20150255426 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-09-10 [patent_title] => 'SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE' [patent_app_type] => utility [patent_app_number] => 14/546484 [patent_app_country] => US [patent_app_date] => 2014-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4481 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14546484 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/546484
SEMICONDUCTOR DEVICE WITH REDUCED WARPAGE Nov 17, 2014 Abandoned
Array ( [id] => 10795078 [patent_doc_number] => 20160141235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-05-19 [patent_title] => 'PRINTED CIRCUIT BOARD ASSEMBLY WITH IMAGE SENSOR MOUNTED THEREON' [patent_app_type] => utility [patent_app_number] => 14/543936 [patent_app_country] => US [patent_app_date] => 2014-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2816 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14543936 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/543936
Printed circuit board assembly with image sensor mounted thereon Nov 17, 2014 Issued
Array ( [id] => 10294597 [patent_doc_number] => 20150179596 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-25 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/543105 [patent_app_country] => US [patent_app_date] => 2014-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3415 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14543105 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/543105
SEMICONDUCTOR PACKAGE Nov 16, 2014 Abandoned
Array ( [id] => 10795077 [patent_doc_number] => 20160141234 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-05-19 [patent_title] => 'INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEABLE LAYER' [patent_app_type] => utility [patent_app_number] => 14/543560 [patent_app_country] => US [patent_app_date] => 2014-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 14601 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14543560 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/543560
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEABLE LAYER Nov 16, 2014 Abandoned
Array ( [id] => 10294554 [patent_doc_number] => 20150179553 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-25 [patent_title] => 'PRE-MOLDED INTEGRATED CIRCUIT PACKAGES' [patent_app_type] => utility [patent_app_number] => 14/536962 [patent_app_country] => US [patent_app_date] => 2014-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4574 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14536962 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/536962
Pre-molded integrated circuit packages Nov 9, 2014 Issued
Array ( [id] => 16048021 [patent_doc_number] => 10685894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2020-06-16 [patent_title] => Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component [patent_app_type] => utility [patent_app_number] => 15/034626 [patent_app_country] => US [patent_app_date] => 2014-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2037 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15034626 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/034626
Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component Oct 13, 2014 Issued
Array ( [id] => 9857954 [patent_doc_number] => 20150037971 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-02-05 [patent_title] => 'CHIP CONNECTION STRUCTURE AND METHOD OF FORMING' [patent_app_type] => utility [patent_app_number] => 14/510426 [patent_app_country] => US [patent_app_date] => 2014-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2658 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14510426 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/510426
CHIP CONNECTION STRUCTURE AND METHOD OF FORMING Oct 8, 2014 Abandoned
Array ( [id] => 10213199 [patent_doc_number] => 20150098191 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-09 [patent_title] => 'Silicon Heat-Dissipation Package For Compact Electronic Devices' [patent_app_type] => utility [patent_app_number] => 14/507779 [patent_app_country] => US [patent_app_date] => 2014-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 11711 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14507779 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/507779
Silicon Heat-Dissipation Package For Compact Electronic Devices Oct 5, 2014 Abandoned
Array ( [id] => 10909461 [patent_doc_number] => 20140312477 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-10-23 [patent_title] => 'Lead And Lead Frame For Power Package' [patent_app_type] => utility [patent_app_number] => 14/320644 [patent_app_country] => US [patent_app_date] => 2014-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3471 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14320644 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/320644
Lead and lead frame for power package Jun 30, 2014 Issued
Array ( [id] => 10479377 [patent_doc_number] => 20150364394 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-17 [patent_title] => 'Method for Building Up a Fan-Out RDL Structure with Fine Pitch Line-Width and Line-Spacing' [patent_app_type] => utility [patent_app_number] => 14/305640 [patent_app_country] => US [patent_app_date] => 2014-06-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 13549 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14305640 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/305640
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing Jun 15, 2014 Issued
Array ( [id] => 10479356 [patent_doc_number] => 20150364373 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-17 [patent_title] => 'Quad Flat No Lead Package And Method Of Making' [patent_app_type] => utility [patent_app_number] => 14/301942 [patent_app_country] => US [patent_app_date] => 2014-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2326 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14301942 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/301942
Quad flat no lead package and method of making Jun 10, 2014 Issued
Array ( [id] => 10472252 [patent_doc_number] => 20150357268 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-10 [patent_title] => 'POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PREPARATION METHOD' [patent_app_type] => utility [patent_app_number] => 14/298892 [patent_app_country] => US [patent_app_date] => 2014-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5588 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14298892 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/298892
Power semiconductor device with small contact footprint and the preparation method Jun 6, 2014 Issued
Array ( [id] => 12334905 [patent_doc_number] => 09947636 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-04-17 [patent_title] => Method for making semiconductor device with lead frame made from top and bottom components and related devices [patent_app_type] => utility [patent_app_number] => 14/293274 [patent_app_country] => US [patent_app_date] => 2014-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 2737 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14293274 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/293274
Method for making semiconductor device with lead frame made from top and bottom components and related devices Jun 1, 2014 Issued
Array ( [id] => 10943633 [patent_doc_number] => 20140346654 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-11-27 [patent_title] => 'CHIP PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/293782 [patent_app_country] => US [patent_app_date] => 2014-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5516 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14293782 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/293782
CHIP PACKAGE Jun 1, 2014 Abandoned
Array ( [id] => 11265844 [patent_doc_number] => 09490146 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-11-08 [patent_title] => 'Semiconductor device with encapsulated lead frame contact area and related methods' [patent_app_type] => utility [patent_app_number] => 14/293364 [patent_app_country] => US [patent_app_date] => 2014-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2422 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14293364 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/293364
Semiconductor device with encapsulated lead frame contact area and related methods Jun 1, 2014 Issued
Array ( [id] => 9716872 [patent_doc_number] => 20140252570 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-11 [patent_title] => 'LEAD-FRAME CIRCUIT PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/285079 [patent_app_country] => US [patent_app_date] => 2014-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4890 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14285079 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/285079
LEAD-FRAME CIRCUIT PACKAGE May 21, 2014 Abandoned
Array ( [id] => 9631908 [patent_doc_number] => 20140210017 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-31 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/243358 [patent_app_country] => US [patent_app_date] => 2014-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 9363 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14243358 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/243358
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Apr 1, 2014 Abandoned
Array ( [id] => 10479410 [patent_doc_number] => 20150364427 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-17 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 14/762595 [patent_app_country] => US [patent_app_date] => 2014-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 6555 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14762595 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/762595
Semiconductor device and method for manufacturing same Jan 22, 2014 Issued
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