Search

Abbigale A. Boyle

Examiner (ID: 6386, Phone: (571)270-7919 , Office: P/2816 )

Most Active Art Unit
2816
Art Unit(s)
2899, 2891, 2816
Total Applications
419
Issued Applications
231
Pending Applications
66
Abandoned Applications
139

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10479428 [patent_doc_number] => 20150364446 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-17 [patent_title] => 'Semiconductor Chip Assembly and Method for Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 14/763898 [patent_app_country] => US [patent_app_date] => 2014-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2283 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14763898 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/763898
Semiconductor chip assembly and method for manufacturing the same Jan 21, 2014 Issued
Array ( [id] => 12214881 [patent_doc_number] => 09911696 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-03-06 [patent_title] => 'Packaged semiconductor assemblies and methods for manufacturing such assemblies' [patent_app_type] => utility [patent_app_number] => 14/152622 [patent_app_country] => US [patent_app_date] => 2014-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 19 [patent_no_of_words] => 8074 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14152622 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/152622
Packaged semiconductor assemblies and methods for manufacturing such assemblies Jan 9, 2014 Issued
Array ( [id] => 10168635 [patent_doc_number] => 09199329 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-12-01 [patent_title] => 'MIG- or MAG-welding gun' [patent_app_type] => utility [patent_app_number] => 14/091025 [patent_app_country] => US [patent_app_date] => 2013-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1366 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14091025 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/091025
MIG- or MAG-welding gun Nov 25, 2013 Issued
Array ( [id] => 10624411 [patent_doc_number] => 09343361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-17 [patent_title] => 'Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/072777 [patent_app_country] => US [patent_app_date] => 2013-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 10945 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14072777 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/072777
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Nov 4, 2013 Issued
Array ( [id] => 10004137 [patent_doc_number] => 09048234 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-02 [patent_title] => 'Off-chip vias in stacked chips' [patent_app_type] => utility [patent_app_number] => 13/914896 [patent_app_country] => US [patent_app_date] => 2013-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 6817 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13914896 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/914896
Off-chip vias in stacked chips Jun 10, 2013 Issued
Array ( [id] => 10260147 [patent_doc_number] => 20150145144 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-28 [patent_title] => 'USE OF A CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION' [patent_app_type] => utility [patent_app_number] => 14/402423 [patent_app_country] => US [patent_app_date] => 2013-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 7845 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14402423 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/402423
USE OF A CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION Jun 5, 2013 Abandoned
Array ( [id] => 13085101 [patent_doc_number] => 10062623 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-08-28 [patent_title] => Semiconductor package substrate, package system using the same and method for manufacturing thereof [patent_app_type] => utility [patent_app_number] => 14/401602 [patent_app_country] => US [patent_app_date] => 2013-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 26 [patent_no_of_words] => 6880 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 366 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14401602 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/401602
Semiconductor package substrate, package system using the same and method for manufacturing thereof May 23, 2013 Issued
Array ( [id] => 11811507 [patent_doc_number] => 09716081 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-25 [patent_title] => 'Assembly of wafer stacks' [patent_app_type] => utility [patent_app_number] => 14/401606 [patent_app_country] => US [patent_app_date] => 2013-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 18 [patent_no_of_words] => 5565 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14401606 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/401606
Assembly of wafer stacks May 14, 2013 Issued
Array ( [id] => 9054668 [patent_doc_number] => 20130252382 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-26 [patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/893937 [patent_app_country] => US [patent_app_date] => 2013-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4674 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13893937 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/893937
Method of manufacturing a semiconductor device May 13, 2013 Issued
Array ( [id] => 11321597 [patent_doc_number] => 09520344 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-12-13 [patent_title] => 'Semiconductor module for electric power' [patent_app_type] => utility [patent_app_number] => 14/401556 [patent_app_country] => US [patent_app_date] => 2013-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 34 [patent_no_of_words] => 18487 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 368 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14401556 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/401556
Semiconductor module for electric power May 6, 2013 Issued
Array ( [id] => 12498438 [patent_doc_number] => 09997440 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2018-06-12 [patent_title] => Protection layer for adhesive material at wafer edge [patent_app_type] => utility [patent_app_number] => 13/864676 [patent_app_country] => US [patent_app_date] => 2013-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2735 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13864676 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/864676
Protection layer for adhesive material at wafer edge Apr 16, 2013 Issued
Array ( [id] => 10624477 [patent_doc_number] => 09343426 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2016-05-17 [patent_title] => 'Use of device assembly for a generalization of three-dimensional metal interconnect technologies' [patent_app_type] => utility [patent_app_number] => 13/735821 [patent_app_country] => US [patent_app_date] => 2013-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 12064 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 300 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13735821 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/735821
Use of device assembly for a generalization of three-dimensional metal interconnect technologies Jan 6, 2013 Issued
Array ( [id] => 10557127 [patent_doc_number] => 09281332 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-08 [patent_title] => 'Package process of backside illumination image sensor' [patent_app_type] => utility [patent_app_number] => 13/668245 [patent_app_country] => US [patent_app_date] => 2012-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3166 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 253 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13668245 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/668245
Package process of backside illumination image sensor Nov 2, 2012 Issued
Array ( [id] => 9266613 [patent_doc_number] => 20140021529 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-01-23 [patent_title] => 'FLASH MEMORY DEVICE WITH WORD LINES OF UNIFORM WIDTH AND METHOD FOR MANUFACTURING THEREOF' [patent_app_type] => utility [patent_app_number] => 13/657047 [patent_app_country] => US [patent_app_date] => 2012-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5302 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13657047 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/657047
FLASH MEMORY DEVICE WITH WORD LINES OF UNIFORM WIDTH AND METHOD FOR MANUFACTURING THEREOF Oct 21, 2012 Abandoned
Array ( [id] => 8634806 [patent_doc_number] => 20130026609 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-31 [patent_title] => 'PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/648114 [patent_app_country] => US [patent_app_date] => 2012-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 13675 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13648114 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/648114
PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE Oct 8, 2012 Abandoned
Array ( [id] => 9360543 [patent_doc_number] => 20140070415 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-13 [patent_title] => 'MICROELECTRONIC PACKAGES HAVING TRENCH VIAS AND METHODS FOR THE MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/610488 [patent_app_country] => US [patent_app_date] => 2012-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7323 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13610488 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/610488
Microelectronic packages having trench vias and methods for the manufacture thereof Sep 10, 2012 Issued
Array ( [id] => 11524450 [patent_doc_number] => 09607862 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-28 [patent_title] => 'Extrusion-resistant solder interconnect structures and methods of forming' [patent_app_type] => utility [patent_app_number] => 13/610262 [patent_app_country] => US [patent_app_date] => 2012-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3142 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13610262 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/610262
Extrusion-resistant solder interconnect structures and methods of forming Sep 10, 2012 Issued
Array ( [id] => 9031683 [patent_doc_number] => 20130234321 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-12 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/609053 [patent_app_country] => US [patent_app_date] => 2012-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4089 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13609053 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/609053
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Sep 9, 2012 Abandoned
Array ( [id] => 10590590 [patent_doc_number] => 09312210 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-12 [patent_title] => 'Semiconductor device with air gap and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 13/606648 [patent_app_country] => US [patent_app_date] => 2012-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 23 [patent_no_of_words] => 8727 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13606648 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/606648
Semiconductor device with air gap and method for fabricating the same Sep 6, 2012 Issued
Array ( [id] => 8718014 [patent_doc_number] => 20130069230 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-03-21 [patent_title] => 'ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS' [patent_app_type] => utility [patent_app_number] => 13/607460 [patent_app_country] => US [patent_app_date] => 2012-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 9188 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13607460 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/607460
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS Sep 6, 2012 Abandoned
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