
Abbigale A. Boyle
Examiner (ID: 6386, Phone: (571)270-7919 , Office: P/2816 )
| Most Active Art Unit | 2816 |
| Art Unit(s) | 2899, 2891, 2816 |
| Total Applications | 419 |
| Issued Applications | 231 |
| Pending Applications | 66 |
| Abandoned Applications | 139 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 15889581
[patent_doc_number] => 10651146
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2020-05-12
[patent_title] => Chip packaging structure and manufacturing method for the same
[patent_app_type] => utility
[patent_app_number] => 13/606147
[patent_app_country] => US
[patent_app_date] => 2012-09-07
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Array
(
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[patent_doc_number] => 20120329227
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[patent_kind] => A1
[patent_issue_date] => 2012-12-27
[patent_title] => 'Formation of Field Effect Transistor Devices'
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[patent_app_number] => 13/605136
[patent_app_country] => US
[patent_app_date] => 2012-09-06
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Array
(
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[patent_title] => 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME'
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Array
(
[id] => 10838606
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[patent_issue_date] => 2014-10-21
[patent_title] => 'Fan-out package comprising bulk metal'
[patent_app_type] => utility
[patent_app_number] => 13/604239
[patent_app_country] => US
[patent_app_date] => 2012-09-05
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/604239 | Fan-out package comprising bulk metal | Sep 4, 2012 | Issued |
Array
(
[id] => 8462619
[patent_doc_number] => 20120267787
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[patent_kind] => A1
[patent_issue_date] => 2012-10-25
[patent_title] => 'Wafer Level Chip Scale Package Method Using Clip Array'
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Array
(
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[patent_doc_number] => 09941176
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-04-10
[patent_title] => Selective solder bump formation on wafer
[patent_app_type] => utility
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Array
(
[id] => 8603974
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[patent_issue_date] => 2013-01-10
[patent_title] => 'SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/471735 | SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME | May 14, 2012 | Abandoned |
Array
(
[id] => 9145467
[patent_doc_number] => 20130299990
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[patent_kind] => A1
[patent_issue_date] => 2013-11-14
[patent_title] => 'SINGLE METAL DAMASCENE STRUCTURE AND METHOD OF FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/471209
[patent_app_country] => US
[patent_app_date] => 2012-05-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/471209 | SINGLE METAL DAMASCENE STRUCTURE AND METHOD OF FORMING THE SAME | May 13, 2012 | Abandoned |
Array
(
[id] => 9145443
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[patent_issue_date] => 2013-11-14
[patent_title] => 'WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD'
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[patent_app_number] => 13/469012
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/469012 | WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD | May 9, 2012 | Abandoned |
Array
(
[id] => 9145466
[patent_doc_number] => 20130299989
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[patent_issue_date] => 2013-11-14
[patent_title] => 'CHIP CONNECTION STRUCTURE AND METHOD OF FORMING'
[patent_app_type] => utility
[patent_app_number] => 13/468750
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Array
(
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Array
(
[id] => 9104724
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Array
(
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Array
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Array
(
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Array
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Array
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Array
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Array
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Array
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