Search

Abbigale A. Boyle

Examiner (ID: 701, Phone: (571)270-7919 , Office: P/2816 )

Most Active Art Unit
2816
Art Unit(s)
2899, 2816, 2891
Total Applications
425
Issued Applications
231
Pending Applications
62
Abandoned Applications
141

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8506592 [patent_doc_number] => 20120306000 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-06 [patent_title] => 'Formation of Field Effect Transistor Devices' [patent_app_type] => utility [patent_app_number] => 13/118689 [patent_app_country] => US [patent_app_date] => 2011-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3267 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13118689 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/118689
Formation of Field Effect Transistor Devices May 30, 2011 Abandoned
Array ( [id] => 8480893 [patent_doc_number] => 20120280300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-08 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/149365 [patent_app_country] => US [patent_app_date] => 2011-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5623 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13149365 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/149365
Semiconductor device and method of manufacturing the same May 30, 2011 Issued
Array ( [id] => 9009913 [patent_doc_number] => 08525214 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-03 [patent_title] => 'Semiconductor chip assembly with post/base heat spreader with thermal via' [patent_app_type] => utility [patent_app_number] => 13/111966 [patent_app_country] => US [patent_app_date] => 2011-05-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 71 [patent_no_of_words] => 27953 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 389 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13111966 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/111966
Semiconductor chip assembly with post/base heat spreader with thermal via May 19, 2011 Issued
Array ( [id] => 8489608 [patent_doc_number] => 20120289015 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-15 [patent_title] => 'METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH ENHANCED CHANNEL STRESS' [patent_app_type] => utility [patent_app_number] => 13/106970 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2280 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13106970 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/106970
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH ENHANCED CHANNEL STRESS May 12, 2011 Abandoned
Array ( [id] => 7567530 [patent_doc_number] => 20110287593 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'METHOD FOR FORMING SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/107057 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 12731 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20110287593.pdf [firstpage_image] =>[orig_patent_app_number] => 13107057 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/107057
METHOD FOR FORMING SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE May 12, 2011 Abandoned
Array ( [id] => 9455110 [patent_doc_number] => 08716117 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-06 [patent_title] => 'Semiconductor device and method of forming the same' [patent_app_type] => utility [patent_app_number] => 13/106977 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 36 [patent_no_of_words] => 9369 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13106977 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/106977
Semiconductor device and method of forming the same May 12, 2011 Issued
Array ( [id] => 10042076 [patent_doc_number] => 09082789 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-07-14 [patent_title] => 'Fabrication methods of integrated semiconductor structure' [patent_app_type] => utility [patent_app_number] => 13/107636 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4820 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 208 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13107636 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/107636
Fabrication methods of integrated semiconductor structure May 12, 2011 Issued
Array ( [id] => 7567517 [patent_doc_number] => 20110287580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/107054 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 21824 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20110287580.pdf [firstpage_image] =>[orig_patent_app_number] => 13107054 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/107054
Method for manufacturing semiconductor device including step of adding cation to oxide semiconductor layer May 12, 2011 Issued
Array ( [id] => 8487012 [patent_doc_number] => 20120286418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-15 [patent_title] => 'Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance' [patent_app_type] => utility [patent_app_number] => 13/107075 [patent_app_country] => US [patent_app_date] => 2011-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7297 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13107075 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/107075
Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance May 12, 2011 Issued
Array ( [id] => 7567550 [patent_doc_number] => 20110287613 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'MANUFACTURING METHOD OF SUPERJUNCTION STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/106778 [patent_app_country] => US [patent_app_date] => 2011-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3480 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20110287613.pdf [firstpage_image] =>[orig_patent_app_number] => 13106778 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/106778
MANUFACTURING METHOD OF SUPERJUNCTION STRUCTURE May 11, 2011 Abandoned
Array ( [id] => 8489561 [patent_doc_number] => 20120288968 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-15 [patent_title] => 'Method for repairing a semiconductor structure having a current-leakage issue' [patent_app_type] => utility [patent_app_number] => 13/106837 [patent_app_country] => US [patent_app_date] => 2011-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1953 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13106837 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/106837
Method for repairing a semiconductor structure having a current-leakage issue May 11, 2011 Abandoned
Array ( [id] => 6058837 [patent_doc_number] => 20110198662 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-18 [patent_title] => 'SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND MULTILEVEL CONDUCTIVE TRACE' [patent_app_type] => utility [patent_app_number] => 13/091162 [patent_app_country] => US [patent_app_date] => 2011-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 40 [patent_no_of_words] => 29014 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0198/20110198662.pdf [firstpage_image] =>[orig_patent_app_number] => 13091162 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/091162
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace Apr 20, 2011 Issued
Array ( [id] => 8469690 [patent_doc_number] => 08298868 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-30 [patent_title] => 'Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole' [patent_app_type] => utility [patent_app_number] => 13/079044 [patent_app_country] => US [patent_app_date] => 2011-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 46 [patent_no_of_words] => 23200 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 359 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13079044 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/079044
Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole Apr 3, 2011 Issued
Array ( [id] => 7801470 [patent_doc_number] => 08129742 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-06 [patent_title] => 'Semiconductor chip assembly with post/base heat spreader and plated through-hole' [patent_app_type] => utility [patent_app_number] => 13/078928 [patent_app_country] => US [patent_app_date] => 2011-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 46 [patent_no_of_words] => 23165 [patent_no_of_claims] => 60 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/129/08129742.pdf [firstpage_image] =>[orig_patent_app_number] => 13078928 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/078928
Semiconductor chip assembly with post/base heat spreader and plated through-hole Apr 1, 2011 Issued
Array ( [id] => 8582964 [patent_doc_number] => 20130001785 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-03 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 13/634212 [patent_app_country] => US [patent_app_date] => 2011-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 6946 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13634212 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/634212
Semiconductor device Mar 31, 2011 Issued
Array ( [id] => 13769459 [patent_doc_number] => 10177079 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-01-08 [patent_title] => Conductive connecting member and manufacturing method of same [patent_app_type] => utility [patent_app_number] => 13/634079 [patent_app_country] => US [patent_app_date] => 2011-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12427 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13634079 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/634079
Conductive connecting member and manufacturing method of same Mar 17, 2011 Issued
Array ( [id] => 8582953 [patent_doc_number] => 20130001774 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-03 [patent_title] => 'ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICALLY CONDUCTIVE CONNECTION MEMBER PRODUCED USING THE PASTE' [patent_app_type] => utility [patent_app_number] => 13/634057 [patent_app_country] => US [patent_app_date] => 2011-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 10692 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13634057 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/634057
Electrically conductive paste, and electrically conducive connection member produced using the paste Mar 17, 2011 Issued
Array ( [id] => 5971131 [patent_doc_number] => 20110151626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-23 [patent_title] => 'METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS' [patent_app_type] => utility [patent_app_number] => 13/031222 [patent_app_country] => US [patent_app_date] => 2011-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 42 [patent_no_of_words] => 33514 [patent_no_of_claims] => 51 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20110151626.pdf [firstpage_image] =>[orig_patent_app_number] => 13031222 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/031222
Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts Feb 19, 2011 Issued
Array ( [id] => 6153350 [patent_doc_number] => 20110156090 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-30 [patent_title] => 'SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS' [patent_app_type] => utility [patent_app_number] => 13/030136 [patent_app_country] => US [patent_app_date] => 2011-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 42 [patent_no_of_words] => 33512 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0156/20110156090.pdf [firstpage_image] =>[orig_patent_app_number] => 13030136 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/030136
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS Feb 17, 2011 Abandoned
Array ( [id] => 7648852 [patent_doc_number] => 20110298121 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-08 [patent_title] => 'POWER SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/027582 [patent_app_country] => US [patent_app_date] => 2011-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5287 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0298/20110298121.pdf [firstpage_image] =>[orig_patent_app_number] => 13027582 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/027582
POWER SEMICONDUCTOR DEVICE Feb 14, 2011 Abandoned
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