
Abbigale A. Boyle
Examiner (ID: 701, Phone: (571)270-7919 , Office: P/2816 )
| Most Active Art Unit | 2816 |
| Art Unit(s) | 2899, 2816, 2891 |
| Total Applications | 425 |
| Issued Applications | 231 |
| Pending Applications | 62 |
| Abandoned Applications | 141 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7564944
[patent_doc_number] => 20110285007
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-11-24
[patent_title] => 'Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP'
[patent_app_type] => utility
[patent_app_number] => 12/786008
[patent_app_country] => US
[patent_app_date] => 2010-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 7848
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0285/20110285007.pdf
[firstpage_image] =>[orig_patent_app_number] => 12786008
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/786008 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | May 23, 2010 | Issued |
Array
(
[id] => 6375997
[patent_doc_number] => 20100301467
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-12-02
[patent_title] => 'WIREBOND STRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 12/786260
[patent_app_country] => US
[patent_app_date] => 2010-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0301/20100301467.pdf
[firstpage_image] =>[orig_patent_app_number] => 12786260
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/786260 | WIREBOND STRUCTURES | May 23, 2010 | Abandoned |
Array
(
[id] => 7738768
[patent_doc_number] => 20120018761
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-01-26
[patent_title] => 'PHOSPHOR MEMBER, METHOD OF MANUFACTURING PHOSPHOR MEMBER, AND ILLUMINATING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/257340
[patent_app_country] => US
[patent_app_date] => 2010-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 11098
[patent_no_of_claims] => 19
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[patent_no_of_assignments] => 0
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[pdf_file] => publications/A1/0018/20120018761.pdf
[firstpage_image] =>[orig_patent_app_number] => 13257340
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/257340 | PHOSPHOR MEMBER, METHOD OF MANUFACTURING PHOSPHOR MEMBER, AND ILLUMINATING DEVICE | Mar 18, 2010 | Abandoned |
Array
(
[id] => 12250173
[patent_doc_number] => 09922955
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-03-20
[patent_title] => 'Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP'
[patent_app_type] => utility
[patent_app_number] => 12/717335
[patent_app_country] => US
[patent_app_date] => 2010-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 22
[patent_no_of_words] => 9844
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12717335
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/717335 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Mar 3, 2010 | Issued |
Array
(
[id] => 6461099
[patent_doc_number] => 20100190300
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-07-29
[patent_title] => 'METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPREADER AND A CAVITY IN THE BASE'
[patent_app_type] => utility
[patent_app_number] => 12/714497
[patent_app_country] => US
[patent_app_date] => 2010-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 32
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[patent_no_of_words] => 20841
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[pdf_file] => publications/A1/0190/20100190300.pdf
[firstpage_image] =>[orig_patent_app_number] => 12714497
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/714497 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPREADER AND A CAVITY IN THE BASE | Feb 27, 2010 | Abandoned |
Array
(
[id] => 8543223
[patent_doc_number] => 08318513
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-27
[patent_title] => 'Method of encapsulating light-emitting diode devices using bent frames'
[patent_app_type] => utility
[patent_app_number] => 12/634115
[patent_app_country] => US
[patent_app_date] => 2009-12-09
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12634115
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/634115 | Method of encapsulating light-emitting diode devices using bent frames | Dec 8, 2009 | Issued |
Array
(
[id] => 6356938
[patent_doc_number] => 20100087057
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-04-08
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/632915
[patent_app_country] => US
[patent_app_date] => 2009-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 4605
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[pdf_file] => publications/A1/0087/20100087057.pdf
[firstpage_image] =>[orig_patent_app_number] => 12632915
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/632915 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Dec 7, 2009 | Abandoned |
Array
(
[id] => 6438430
[patent_doc_number] => 20100144088
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-06-10
[patent_title] => 'METHOD FOR FORMING METAL OXIDE AND METHOD FOR FORMING TRANSISTOR STRUCTURE WITH THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/631206
[patent_app_country] => US
[patent_app_date] => 2009-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0144/20100144088.pdf
[firstpage_image] =>[orig_patent_app_number] => 12631206
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/631206 | METHOD FOR FORMING METAL OXIDE AND METHOD FOR FORMING TRANSISTOR STRUCTURE WITH THE SAME | Dec 3, 2009 | Abandoned |
Array
(
[id] => 6371998
[patent_doc_number] => 20100075448
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-03-25
[patent_title] => 'METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER'
[patent_app_type] => utility
[patent_app_number] => 12/626940
[patent_app_country] => US
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[patent_drawing_sheets_cnt] => 31
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[pdf_file] => publications/A1/0075/20100075448.pdf
[firstpage_image] =>[orig_patent_app_number] => 12626940
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/626940 | Method of making a semiconductor chip assembly with a post/base/cap heat spreader | Nov 29, 2009 | Issued |
Array
(
[id] => 8082855
[patent_doc_number] => 08148747
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-03
[patent_title] => 'Semiconductor chip assembly with post/base/cap heat spreader'
[patent_app_type] => utility
[patent_app_number] => 12/626883
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[patent_app_date] => 2009-11-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/148/08148747.pdf
[firstpage_image] =>[orig_patent_app_number] => 12626883
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/626883 | Semiconductor chip assembly with post/base/cap heat spreader | Nov 27, 2009 | Issued |
Array
(
[id] => 7751405
[patent_doc_number] => 08110446
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-07
[patent_title] => 'Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace'
[patent_app_type] => utility
[patent_app_number] => 12/617725
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[pdf_file] => patents/08/110/08110446.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/617725 | Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace | Nov 12, 2009 | Issued |
Array
(
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Array
(
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Array
(
[id] => 6215872
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Array
(
[id] => 6562088
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Array
(
[id] => 6113557
[patent_doc_number] => 20110073570
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[patent_kind] => A1
[patent_issue_date] => 2011-03-31
[patent_title] => 'FLUX CORED WIRE FOR GAS SHIELDED ARC WELDING OF HIGH STRENGTH STEEL'
[patent_app_type] => utility
[patent_app_number] => 12/566856
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/566856 | FLUX CORED WIRE FOR GAS SHIELDED ARC WELDING OF HIGH STRENGTH STEEL | Sep 24, 2009 | Abandoned |
Array
(
[id] => 6321319
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/562049 | Lead and lead frame for power package | Sep 16, 2009 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/561929 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF | Sep 16, 2009 | Abandoned |
Array
(
[id] => 6514758
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/560538 | WAVEFORM CONTROL IN DRAWN ARC FASTENER WELDING | Sep 15, 2009 | Abandoned |