Search

Abbigale A. Boyle

Examiner (ID: 6386, Phone: (571)270-7919 , Office: P/2816 )

Most Active Art Unit
2816
Art Unit(s)
2899, 2891, 2816
Total Applications
419
Issued Applications
231
Pending Applications
66
Abandoned Applications
139

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16226235 [patent_doc_number] => 20200251352 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-08-06 [patent_title] => Quad Flat No Lead Package And Method Of Making [patent_app_type] => utility [patent_app_number] => 16/853186 [patent_app_country] => US [patent_app_date] => 2020-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2332 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16853186 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/853186
Quad flat no lead package and method of making Apr 19, 2020 Issued
Array ( [id] => 19183784 [patent_doc_number] => 11990384 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Amplifier modules with power transistor die and peripheral ground connections [patent_app_type] => utility [patent_app_number] => 16/852064 [patent_app_country] => US [patent_app_date] => 2020-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 10894 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 306 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16852064 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/852064
Amplifier modules with power transistor die and peripheral ground connections Apr 16, 2020 Issued
Array ( [id] => 16210454 [patent_doc_number] => 20200243444 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-30 [patent_title] => PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 16/847489 [patent_app_country] => US [patent_app_date] => 2020-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7691 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16847489 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/847489
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES Apr 12, 2020 Abandoned
Array ( [id] => 17395856 [patent_doc_number] => 11244880 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-02-08 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/839635 [patent_app_country] => US [patent_app_date] => 2020-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 8959 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16839635 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/839635
Semiconductor device Apr 2, 2020 Issued
Array ( [id] => 17115597 [patent_doc_number] => 20210296194 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER [patent_app_type] => utility [patent_app_number] => 16/822353 [patent_app_country] => US [patent_app_date] => 2020-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7358 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -25 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16822353 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/822353
Molded semiconductor chip package with stair-step molding layer Mar 17, 2020 Issued
Array ( [id] => 16332307 [patent_doc_number] => 20200303273 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-09-24 [patent_title] => POWER MODULE [patent_app_type] => utility [patent_app_number] => 16/812436 [patent_app_country] => US [patent_app_date] => 2020-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5118 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16812436 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/812436
POWER MODULE Mar 8, 2020 Abandoned
Array ( [id] => 17085500 [patent_doc_number] => 20210280507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => PACKAGE COMPRISING DUMMY INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 16/810589 [patent_app_country] => US [patent_app_date] => 2020-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7955 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16810589 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/810589
PACKAGE COMPRISING DUMMY INTERCONNECTS Mar 4, 2020 Pending
Array ( [id] => 17615749 [patent_doc_number] => 20220158029 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-19 [patent_title] => SUBSTRATE AND LIGHT EMITTING ELEMENT [patent_app_type] => utility [patent_app_number] => 17/434693 [patent_app_country] => US [patent_app_date] => 2020-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20581 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17434693 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/434693
SUBSTRATE AND LIGHT EMITTING ELEMENT Feb 26, 2020 Abandoned
Array ( [id] => 17404739 [patent_doc_number] => 20220046830 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-10 [patent_title] => ELECTRONIC CONVERTER DESIGNED ON THE BASIS OF WELDING TECHNOLOGIES [patent_app_type] => utility [patent_app_number] => 17/435547 [patent_app_country] => US [patent_app_date] => 2020-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3368 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17435547 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/435547
ELECTRONIC CONVERTER DESIGNED ON THE BASIS OF WELDING TECHNOLOGIES Feb 26, 2020 Pending
Array ( [id] => 17010937 [patent_doc_number] => 20210242098 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-05 [patent_title] => VARIABLE THICKNESS LID ADHESIVE [patent_app_type] => utility [patent_app_number] => 16/779971 [patent_app_country] => US [patent_app_date] => 2020-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6705 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16779971 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/779971
VARIABLE THICKNESS LID ADHESIVE Feb 2, 2020 Abandoned
Array ( [id] => 15906031 [patent_doc_number] => 20200152536 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-14 [patent_title] => ELECTRONIC COMPONENT [patent_app_type] => utility [patent_app_number] => 16/744449 [patent_app_country] => US [patent_app_date] => 2020-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4737 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16744449 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/744449
Electronic component Jan 15, 2020 Issued
Array ( [id] => 16119861 [patent_doc_number] => 20200211953 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-02 [patent_title] => LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 16/726070 [patent_app_country] => US [patent_app_date] => 2019-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4785 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16726070 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/726070
Leadframe with a metal oxide coating and method of forming the same Dec 22, 2019 Issued
Array ( [id] => 15840737 [patent_doc_number] => 20200135651 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-04-30 [patent_title] => PACKAGE STRUCTURE WITH BUMP [patent_app_type] => utility [patent_app_number] => 16/725321 [patent_app_country] => US [patent_app_date] => 2019-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7155 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16725321 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/725321
Package structure with bump Dec 22, 2019 Issued
Array ( [id] => 16888958 [patent_doc_number] => 20210175155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-10 [patent_title] => POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 16/705898 [patent_app_country] => US [patent_app_date] => 2019-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3353 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16705898 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/705898
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND METHOD OF MAKING THE SAME Dec 5, 2019 Pending
Array ( [id] => 16888941 [patent_doc_number] => 20210175138 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-10 [patent_title] => Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection [patent_app_type] => utility [patent_app_number] => 16/704644 [patent_app_country] => US [patent_app_date] => 2019-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13754 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16704644 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/704644
Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection Dec 4, 2019 Pending
Array ( [id] => 17559126 [patent_doc_number] => 11315848 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-26 [patent_title] => Semiconductor device and method of manufacturing semiconductor device [patent_app_type] => utility [patent_app_number] => 16/703037 [patent_app_country] => US [patent_app_date] => 2019-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 52 [patent_no_of_words] => 19504 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16703037 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/703037
Semiconductor device and method of manufacturing semiconductor device Dec 3, 2019 Issued
Array ( [id] => 16020915 [patent_doc_number] => 20200185301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-06-11 [patent_title] => Semiconductor Package, Metal Sheet for Use in a Semiconductor Package, and Method for Producing a Semiconductor Package [patent_app_type] => utility [patent_app_number] => 16/701251 [patent_app_country] => US [patent_app_date] => 2019-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5626 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16701251 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/701251
Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package Dec 2, 2019 Issued
Array ( [id] => 17210709 [patent_doc_number] => 11171086 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-09 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/700485 [patent_app_country] => US [patent_app_date] => 2019-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8050 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 243 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16700485 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/700485
Semiconductor device Dec 1, 2019 Issued
Array ( [id] => 18235983 [patent_doc_number] => 11600547 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-07 [patent_title] => Semiconductor package with expanded heat spreader [patent_app_type] => utility [patent_app_number] => 16/700361 [patent_app_country] => US [patent_app_date] => 2019-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 33 [patent_no_of_words] => 6917 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16700361 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/700361
Semiconductor package with expanded heat spreader Dec 1, 2019 Issued
Array ( [id] => 18507573 [patent_doc_number] => 11705400 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-18 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 16/699265 [patent_app_country] => US [patent_app_date] => 2019-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 8053 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16699265 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/699265
Semiconductor package Nov 28, 2019 Issued
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