
Adir Aronovich
Examiner (ID: 7954)
| Most Active Art Unit | 2912 |
| Art Unit(s) | 2917, 2900, 2902, 2915, 2916, 2912 |
| Total Applications | 5286 |
| Issued Applications | 5229 |
| Pending Applications | 9 |
| Abandoned Applications | 48 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19176203
[patent_doc_number] => 20240162177
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-16
[patent_title] => SEMICONDUCTOR DEVICE WITH AIR GAP
[patent_app_type] => utility
[patent_app_number] => 18/367620
[patent_app_country] => US
[patent_app_date] => 2023-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7653
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18367620
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/367620 | SEMICONDUCTOR DEVICE WITH AIR GAP | Sep 12, 2023 | Pending |
Array
(
[id] => 19821173
[patent_doc_number] => 20250079380
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-03-06
[patent_title] => Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation
[patent_app_type] => utility
[patent_app_number] => 18/459777
[patent_app_country] => US
[patent_app_date] => 2023-09-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4587
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 33
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18459777
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/459777 | Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation | Aug 31, 2023 | Pending |
Array
(
[id] => 19023179
[patent_doc_number] => 20240079350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-07
[patent_title] => ELECTRONIC COMPONENT WITH REDUCED STRESS
[patent_app_type] => utility
[patent_app_number] => 18/457664
[patent_app_country] => US
[patent_app_date] => 2023-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4901
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18457664
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/457664 | ELECTRONIC COMPONENT WITH REDUCED STRESS | Aug 28, 2023 | Pending |
Array
(
[id] => 19804142
[patent_doc_number] => 20250070067
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-02-27
[patent_title] => ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER
[patent_app_type] => utility
[patent_app_number] => 18/454657
[patent_app_country] => US
[patent_app_date] => 2023-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6713
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 182
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18454657
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/454657 | ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER | Aug 22, 2023 | Pending |
Array
(
[id] => 19023351
[patent_doc_number] => 20240079522
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-07
[patent_title] => LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/234734
[patent_app_country] => US
[patent_app_date] => 2023-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 24597
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -30
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18234734
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/234734 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Aug 15, 2023 | Pending |
Array
(
[id] => 19773508
[patent_doc_number] => 20250054934
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-02-13
[patent_title] => FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDUCE OVERSPREADING OF UNDERFILL MATERIAL
[patent_app_type] => utility
[patent_app_number] => 18/366327
[patent_app_country] => US
[patent_app_date] => 2023-08-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9999
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18366327
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/366327 | FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDUCE OVERSPREADING OF UNDERFILL MATERIAL | Aug 6, 2023 | Pending |
Array
(
[id] => 18991311
[patent_doc_number] => 20240063280
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-22
[patent_title] => MOSFET TRANSISTOR
[patent_app_type] => utility
[patent_app_number] => 18/230423
[patent_app_country] => US
[patent_app_date] => 2023-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6279
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18230423
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/230423 | MOSFET TRANSISTOR | Aug 3, 2023 | Pending |
Array
(
[id] => 19146329
[patent_doc_number] => 20240145359
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-02
[patent_title] => WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/223175
[patent_app_country] => US
[patent_app_date] => 2023-07-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7008
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18223175
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/223175 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Jul 17, 2023 | Pending |
Array
(
[id] => 18906071
[patent_doc_number] => 20240021556
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/347904
[patent_app_country] => US
[patent_app_date] => 2023-07-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12299
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -7
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18347904
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/347904 | CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE | Jul 5, 2023 | Pending |
Array
(
[id] => 19191516
[patent_doc_number] => 20240170429
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-23
[patent_title] => SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/346371
[patent_app_country] => US
[patent_app_date] => 2023-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4667
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346371
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/346371 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Jul 2, 2023 | Pending |
Array
(
[id] => 19662101
[patent_doc_number] => 20240429166
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-12-26
[patent_title] => TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS
[patent_app_type] => utility
[patent_app_number] => 18/213523
[patent_app_country] => US
[patent_app_date] => 2023-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12002
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 154
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213523
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/213523 | TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS | Jun 22, 2023 | Pending |
Array
(
[id] => 18821243
[patent_doc_number] => 20230395584
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-07
[patent_title] => MICRO PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/203906
[patent_app_country] => US
[patent_app_date] => 2023-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8682
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18203906
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/203906 | MICRO PACKAGE STRUCTURE | May 30, 2023 | Pending |
Array
(
[id] => 19407225
[patent_doc_number] => 20240290736
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-29
[patent_title] => MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
[patent_app_type] => utility
[patent_app_number] => 18/175079
[patent_app_country] => US
[patent_app_date] => 2023-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4333
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18175079
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/175079 | MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS | Feb 26, 2023 | Pending |
Array
(
[id] => 19206266
[patent_doc_number] => 20240178165
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-30
[patent_title] => STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT
[patent_app_type] => utility
[patent_app_number] => 18/058932
[patent_app_country] => US
[patent_app_date] => 2022-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4640
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18058932
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/058932 | STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT | Nov 27, 2022 | Pending |
Array
(
[id] => 20389337
[patent_doc_number] => 12489072
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-02
[patent_title] => Semiconductor device with air gap and method for preparing the same
[patent_app_type] => utility
[patent_app_number] => 17/986314
[patent_app_country] => US
[patent_app_date] => 2022-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 3041
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17986314
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/986314 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME | Nov 13, 2022 | Pending |
Array
(
[id] => 19176201
[patent_doc_number] => 20240162175
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-16
[patent_title] => SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER
[patent_app_type] => utility
[patent_app_number] => 18/054806
[patent_app_country] => US
[patent_app_date] => 2022-11-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 21447
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054806
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/054806 | SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER | Nov 10, 2022 | Pending |
Array
(
[id] => 19146328
[patent_doc_number] => 20240145358
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-05-02
[patent_title] => WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/973641
[patent_app_country] => US
[patent_app_date] => 2022-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6966
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973641
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/973641 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE | Oct 25, 2022 | Pending |
Array
(
[id] => 19071170
[patent_doc_number] => 20240105596
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-28
[patent_title] => INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 17/935627
[patent_app_country] => US
[patent_app_date] => 2022-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 16384
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935627
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Sep 26, 2022 | Pending |
Array
(
[id] => 18269451
[patent_doc_number] => 20230090693
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-23
[patent_title] => DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/944248
[patent_app_country] => US
[patent_app_date] => 2022-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9760
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17944248
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/944248 | DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Sep 13, 2022 | Pending |
Array
(
[id] => 18379821
[patent_doc_number] => 20230154910
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-18
[patent_title] => SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/899025
[patent_app_country] => US
[patent_app_date] => 2022-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10298
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17899025
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/899025 | SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME | Aug 29, 2022 | Pending |