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Adir Aronovich

Examiner (ID: 7954)

Most Active Art Unit
2912
Art Unit(s)
2917, 2900, 2902, 2915, 2916, 2912
Total Applications
5286
Issued Applications
5229
Pending Applications
9
Abandoned Applications
48

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19176203 [patent_doc_number] => 20240162177 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => SEMICONDUCTOR DEVICE WITH AIR GAP [patent_app_type] => utility [patent_app_number] => 18/367620 [patent_app_country] => US [patent_app_date] => 2023-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7653 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18367620 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/367620
SEMICONDUCTOR DEVICE WITH AIR GAP Sep 12, 2023 Pending
Array ( [id] => 19821173 [patent_doc_number] => 20250079380 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-06 [patent_title] => Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation [patent_app_type] => utility [patent_app_number] => 18/459777 [patent_app_country] => US [patent_app_date] => 2023-09-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4587 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18459777 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/459777
Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation Aug 31, 2023 Pending
Array ( [id] => 19023179 [patent_doc_number] => 20240079350 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => ELECTRONIC COMPONENT WITH REDUCED STRESS [patent_app_type] => utility [patent_app_number] => 18/457664 [patent_app_country] => US [patent_app_date] => 2023-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4901 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18457664 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/457664
ELECTRONIC COMPONENT WITH REDUCED STRESS Aug 28, 2023 Pending
Array ( [id] => 19804142 [patent_doc_number] => 20250070067 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-27 [patent_title] => ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER [patent_app_type] => utility [patent_app_number] => 18/454657 [patent_app_country] => US [patent_app_date] => 2023-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6713 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18454657 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/454657
ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER Aug 22, 2023 Pending
Array ( [id] => 19023351 [patent_doc_number] => 20240079522 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/234734 [patent_app_country] => US [patent_app_date] => 2023-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24597 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -30 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18234734 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/234734
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Aug 15, 2023 Pending
Array ( [id] => 19773508 [patent_doc_number] => 20250054934 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-13 [patent_title] => FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDUCE OVERSPREADING OF UNDERFILL MATERIAL [patent_app_type] => utility [patent_app_number] => 18/366327 [patent_app_country] => US [patent_app_date] => 2023-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9999 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18366327 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/366327
FORMING A CAVITY IN A REDISTRIBUTION LAYER OF AN IC PACKAGE TO REDUCE OVERSPREADING OF UNDERFILL MATERIAL Aug 6, 2023 Pending
Array ( [id] => 18991311 [patent_doc_number] => 20240063280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => MOSFET TRANSISTOR [patent_app_type] => utility [patent_app_number] => 18/230423 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6279 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18230423 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/230423
MOSFET TRANSISTOR Aug 3, 2023 Pending
Array ( [id] => 19146329 [patent_doc_number] => 20240145359 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/223175 [patent_app_country] => US [patent_app_date] => 2023-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7008 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18223175 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/223175
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Jul 17, 2023 Pending
Array ( [id] => 18906071 [patent_doc_number] => 20240021556 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/347904 [patent_app_country] => US [patent_app_date] => 2023-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12299 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18347904 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/347904
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE Jul 5, 2023 Pending
Array ( [id] => 19191516 [patent_doc_number] => 20240170429 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-23 [patent_title] => SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/346371 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4667 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346371 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/346371
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Jul 2, 2023 Pending
Array ( [id] => 19662101 [patent_doc_number] => 20240429166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS [patent_app_type] => utility [patent_app_number] => 18/213523 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12002 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213523 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/213523
TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS Jun 22, 2023 Pending
Array ( [id] => 18821243 [patent_doc_number] => 20230395584 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => MICRO PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/203906 [patent_app_country] => US [patent_app_date] => 2023-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8682 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18203906 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/203906
MICRO PACKAGE STRUCTURE May 30, 2023 Pending
Array ( [id] => 19407225 [patent_doc_number] => 20240290736 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 18/175079 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4333 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18175079 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/175079
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS Feb 26, 2023 Pending
Array ( [id] => 19206266 [patent_doc_number] => 20240178165 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT [patent_app_type] => utility [patent_app_number] => 18/058932 [patent_app_country] => US [patent_app_date] => 2022-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4640 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18058932 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/058932
STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT Nov 27, 2022 Pending
Array ( [id] => 20389337 [patent_doc_number] => 12489072 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => Semiconductor device with air gap and method for preparing the same [patent_app_type] => utility [patent_app_number] => 17/986314 [patent_app_country] => US [patent_app_date] => 2022-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 3041 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17986314 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/986314
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME Nov 13, 2022 Pending
Array ( [id] => 19176201 [patent_doc_number] => 20240162175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER [patent_app_type] => utility [patent_app_number] => 18/054806 [patent_app_country] => US [patent_app_date] => 2022-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 21447 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18054806 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/054806
SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER Nov 10, 2022 Pending
Array ( [id] => 19146328 [patent_doc_number] => 20240145358 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/973641 [patent_app_country] => US [patent_app_date] => 2022-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6966 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973641 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/973641
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE Oct 25, 2022 Pending
Array ( [id] => 19071170 [patent_doc_number] => 20240105596 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 17/935627 [patent_app_country] => US [patent_app_date] => 2022-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16384 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17935627 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/935627
INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS Sep 26, 2022 Pending
Array ( [id] => 18269451 [patent_doc_number] => 20230090693 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/944248 [patent_app_country] => US [patent_app_date] => 2022-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9760 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17944248 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/944248
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE Sep 13, 2022 Pending
Array ( [id] => 18379821 [patent_doc_number] => 20230154910 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/899025 [patent_app_country] => US [patent_app_date] => 2022-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10298 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17899025 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/899025
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME Aug 29, 2022 Pending
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