Search

Ajay Arora

Examiner (ID: 4150, Phone: (571)272-8347 , Office: P/2892 )

Most Active Art Unit
2892
Art Unit(s)
2892, 2811
Total Applications
1236
Issued Applications
1005
Pending Applications
90
Abandoned Applications
181

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20260757 [patent_doc_number] => 12433128 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Chip with pads of differing width and display module with the same [patent_app_type] => utility [patent_app_number] => 17/505482 [patent_app_country] => US [patent_app_date] => 2021-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1103 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505482 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/505482
Chip with pads of differing width and display module with the same Oct 18, 2021 Issued
Array ( [id] => 20260757 [patent_doc_number] => 12433128 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-30 [patent_title] => Chip with pads of differing width and display module with the same [patent_app_type] => utility [patent_app_number] => 17/505482 [patent_app_country] => US [patent_app_date] => 2021-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1103 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17505482 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/505482
Chip with pads of differing width and display module with the same Oct 18, 2021 Issued
Array ( [id] => 19229642 [patent_doc_number] => 12009286 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages [patent_app_type] => utility [patent_app_number] => 17/504284 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4876 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17504284 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/504284
Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages Oct 17, 2021 Issued
Array ( [id] => 17389362 [patent_doc_number] => 20220037214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND AN APPARATUS FOR TESTING FLIP CHIPS [patent_app_type] => utility [patent_app_number] => 17/502980 [patent_app_country] => US [patent_app_date] => 2021-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3583 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17502980 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/502980
Method of manufacturing a molded flip chip package to facilitate electrical testing Oct 14, 2021 Issued
Array ( [id] => 18721610 [patent_doc_number] => 11798967 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Image sensor package with transparent adhesive covering the optical sensing circuit [patent_app_type] => utility [patent_app_number] => 17/495047 [patent_app_country] => US [patent_app_date] => 2021-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2112 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495047 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/495047
Image sensor package with transparent adhesive covering the optical sensing circuit Oct 5, 2021 Issued
Array ( [id] => 19444516 [patent_doc_number] => 12094806 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-17 [patent_title] => Blocking element for connecting pins of semiconductor dice [patent_app_type] => utility [patent_app_number] => 17/491082 [patent_app_country] => US [patent_app_date] => 2021-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 3822 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17491082 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/491082
Blocking element for connecting pins of semiconductor dice Sep 29, 2021 Issued
Array ( [id] => 18578980 [patent_doc_number] => 11735520 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-22 [patent_title] => Method for fabricating semiconductor device with programmable anti-fuse feature [patent_app_type] => utility [patent_app_number] => 17/490587 [patent_app_country] => US [patent_app_date] => 2021-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 8907 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17490587 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/490587
Method for fabricating semiconductor device with programmable anti-fuse feature Sep 29, 2021 Issued
Array ( [id] => 18943472 [patent_doc_number] => 20240038611 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing Method [patent_app_type] => utility [patent_app_number] => 18/039896 [patent_app_country] => US [patent_app_date] => 2021-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8455 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18039896 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/039896
Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing Method Sep 28, 2021 Pending
Array ( [id] => 18943472 [patent_doc_number] => 20240038611 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-01 [patent_title] => Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing Method [patent_app_type] => utility [patent_app_number] => 18/039896 [patent_app_country] => US [patent_app_date] => 2021-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8455 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18039896 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/039896
Electrical Circuit Body, Power Converter, and Electrical Circuit Body Manufacturing Method Sep 28, 2021 Pending
Array ( [id] => 18985431 [patent_doc_number] => 11910643 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2024-02-20 [patent_title] => Low cost micro OLED structure and method [patent_app_type] => utility [patent_app_number] => 17/484638 [patent_app_country] => US [patent_app_date] => 2021-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 9310 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17484638 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/484638
Low cost micro OLED structure and method Sep 23, 2021 Issued
Array ( [id] => 18264938 [patent_doc_number] => 20230086180 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-23 [patent_title] => DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION [patent_app_type] => utility [patent_app_number] => 17/479854 [patent_app_country] => US [patent_app_date] => 2021-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7356 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17479854 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/479854
DEFORMABLE SEMICONDUCTOR DEVICE CONNECTION Sep 19, 2021 Pending
Array ( [id] => 18882995 [patent_doc_number] => 20240006364 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/248799 [patent_app_country] => US [patent_app_date] => 2021-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8292 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18248799 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/248799
SEMICONDUCTOR DEVICE Sep 15, 2021 Pending
Array ( [id] => 17477394 [patent_doc_number] => 20220084898 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-17 [patent_title] => METHOD OF MANUFACTURING ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/471577 [patent_app_country] => US [patent_app_date] => 2021-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8948 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 250 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17471577 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/471577
Method of manufacturing electronic devices with a cap and molding Sep 9, 2021 Issued
Array ( [id] => 18223964 [patent_doc_number] => 20230062958 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/462850 [patent_app_country] => US [patent_app_date] => 2021-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7235 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462850 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/462850
Semiconductor package structure having ring portion with recess for adhesive and method for forming the same Aug 30, 2021 Issued
Array ( [id] => 17886475 [patent_doc_number] => 20220301953 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => RESISTANCE PATTERNS FOR AN ON-DIE EPM [patent_app_type] => utility [patent_app_number] => 17/462118 [patent_app_country] => US [patent_app_date] => 2021-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8209 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17462118 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/462118
Resistance patterns for an On-Die EPM Aug 30, 2021 Issued
Array ( [id] => 18097420 [patent_doc_number] => 20220415761 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION [patent_app_type] => utility [patent_app_number] => 17/458811 [patent_app_country] => US [patent_app_date] => 2021-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4051 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17458811 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/458811
Lead-frame assembly, semiconductor package and methods for improved adhesion Aug 26, 2021 Issued
Array ( [id] => 18653197 [patent_doc_number] => 20230299037 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => Al WIRING MATERIAL [patent_app_type] => utility [patent_app_number] => 18/022978 [patent_app_country] => US [patent_app_date] => 2021-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10881 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18022978 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/022978
Al WIRING MATERIAL Aug 23, 2021 Pending
Array ( [id] => 18367745 [patent_doc_number] => 11647890 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-16 [patent_title] => Solid-state image pickup element, electronic equipment, and semiconductor apparatus [patent_app_type] => utility [patent_app_number] => 17/445232 [patent_app_country] => US [patent_app_date] => 2021-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 11523 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17445232 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/445232
Solid-state image pickup element, electronic equipment, and semiconductor apparatus Aug 16, 2021 Issued
Array ( [id] => 18983749 [patent_doc_number] => 11908939 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-20 [patent_title] => Method of making a FinFET device including a step of recessing a subset of the fins [patent_app_type] => utility [patent_app_number] => 17/403318 [patent_app_country] => US [patent_app_date] => 2021-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3634 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17403318 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/403318
Method of making a FinFET device including a step of recessing a subset of the fins Aug 15, 2021 Issued
Array ( [id] => 18999138 [patent_doc_number] => 11915994 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-27 [patent_title] => Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/401276 [patent_app_country] => US [patent_app_date] => 2021-08-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 11261 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17401276 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/401276
Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereof Aug 11, 2021 Issued
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