
Ajay Arora
Examiner (ID: 12666, Phone: (571)272-8347 , Office: P/2892 )
| Most Active Art Unit | 2892 |
| Art Unit(s) | 2892, 2811 |
| Total Applications | 1272 |
| Issued Applications | 1029 |
| Pending Applications | 83 |
| Abandoned Applications | 184 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5262359
[patent_doc_number] => 20090115044
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-07
[patent_title] => 'STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING'
[patent_app_type] => utility
[patent_app_number] => 12/110181
[patent_app_country] => US
[patent_app_date] => 2008-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3401
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0115/20090115044.pdf
[firstpage_image] =>[orig_patent_app_number] => 12110181
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/110181 | Structures and methods for stack type semiconductor packaging | Apr 24, 2008 | Issued |
Array
(
[id] => 4483574
[patent_doc_number] => 07901992
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-08
[patent_title] => 'Die bonding agent and a semiconductor device made by using the same'
[patent_app_type] => utility
[patent_app_number] => 12/081992
[patent_app_country] => US
[patent_app_date] => 2008-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5680
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/901/07901992.pdf
[firstpage_image] =>[orig_patent_app_number] => 12081992
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/081992 | Die bonding agent and a semiconductor device made by using the same | Apr 23, 2008 | Issued |
Array
(
[id] => 4883979
[patent_doc_number] => 20080258311
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-23
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/107391
[patent_app_country] => US
[patent_app_date] => 2008-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2336
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0258/20080258311.pdf
[firstpage_image] =>[orig_patent_app_number] => 12107391
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/107391 | Semiconductor device and method of manufacturing the same | Apr 21, 2008 | Issued |
Array
(
[id] => 4952686
[patent_doc_number] => 20080185710
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-07
[patent_title] => 'CHIP PACKAGE AND PROCESS THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/100631
[patent_app_country] => US
[patent_app_date] => 2008-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3109
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0185/20080185710.pdf
[firstpage_image] =>[orig_patent_app_number] => 12100631
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/100631 | CHIP PACKAGE AND PROCESS THEREOF | Apr 9, 2008 | Abandoned |
Array
(
[id] => 4479592
[patent_doc_number] => 07906815
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-15
[patent_title] => 'Increased reliability for a contact structure to connect an active region with a polysilicon line'
[patent_app_type] => utility
[patent_app_number] => 12/056362
[patent_app_country] => US
[patent_app_date] => 2008-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 9181
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/906/07906815.pdf
[firstpage_image] =>[orig_patent_app_number] => 12056362
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/056362 | Increased reliability for a contact structure to connect an active region with a polysilicon line | Mar 26, 2008 | Issued |
Array
(
[id] => 5473754
[patent_doc_number] => 20090246920
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-01
[patent_title] => 'METHODS FOR NORMALIZING STRAIN IN A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/057072
[patent_app_country] => US
[patent_app_date] => 2008-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3225
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0246/20090246920.pdf
[firstpage_image] =>[orig_patent_app_number] => 12057072
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/057072 | Methods for normalizing strain in a semiconductor device | Mar 26, 2008 | Issued |
Array
(
[id] => 43708
[patent_doc_number] => 07776722
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-17
[patent_title] => 'Manufacturing methods of semiconductor substrate, thin film transistor and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/076992
[patent_app_country] => US
[patent_app_date] => 2008-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 32
[patent_no_of_words] => 10166
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 219
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/776/07776722.pdf
[firstpage_image] =>[orig_patent_app_number] => 12076992
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/076992 | Manufacturing methods of semiconductor substrate, thin film transistor and semiconductor device | Mar 25, 2008 | Issued |
Array
(
[id] => 5319806
[patent_doc_number] => 20090057796
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-05
[patent_title] => 'PHOTODIODE BEING MONOLITHICALLY INTEGRATED ONTO A WAVEGUIDE'
[patent_app_type] => utility
[patent_app_number] => 12/052891
[patent_app_country] => US
[patent_app_date] => 2008-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 4391
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0057/20090057796.pdf
[firstpage_image] =>[orig_patent_app_number] => 12052891
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/052891 | Photodiode being monolithically integrated onto a waveguide | Mar 20, 2008 | Issued |
Array
(
[id] => 4483734
[patent_doc_number] => 07902034
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-08
[patent_title] => 'Method of manufacturing SOI substrate and method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/076691
[patent_app_country] => US
[patent_app_date] => 2008-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 26
[patent_no_of_words] => 15163
[patent_no_of_claims] => 40
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/902/07902034.pdf
[firstpage_image] =>[orig_patent_app_number] => 12076691
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/076691 | Method of manufacturing SOI substrate and method of manufacturing semiconductor device | Mar 20, 2008 | Issued |
Array
(
[id] => 7540869
[patent_doc_number] => 08058713
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-15
[patent_title] => 'COF package and tape substrate used in same'
[patent_app_type] => utility
[patent_app_number] => 12/052172
[patent_app_country] => US
[patent_app_date] => 2008-03-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3170
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/058/08058713.pdf
[firstpage_image] =>[orig_patent_app_number] => 12052172
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/052172 | COF package and tape substrate used in same | Mar 19, 2008 | Issued |
Array
(
[id] => 4737111
[patent_doc_number] => 20080230763
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-25
[patent_title] => 'Metallic Nanospheres Embedded in Nanowires Initiated on Nanostructures and Methods for Synthesis Thereof'
[patent_app_type] => utility
[patent_app_number] => 12/051681
[patent_app_country] => US
[patent_app_date] => 2008-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7134
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20080230763.pdf
[firstpage_image] =>[orig_patent_app_number] => 12051681
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/051681 | Metallic nanospheres embedded in nanowires initiated on nanostructures and methods for synthesis thereof | Mar 18, 2008 | Issued |
Array
(
[id] => 5401334
[patent_doc_number] => 20090236647
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-24
[patent_title] => 'SEMICONDUCTOR DEVICE WITH CAPACITOR'
[patent_app_type] => utility
[patent_app_number] => 12/050192
[patent_app_country] => US
[patent_app_date] => 2008-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 8148
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0236/20090236647.pdf
[firstpage_image] =>[orig_patent_app_number] => 12050192
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/050192 | SEMICONDUCTOR DEVICE WITH CAPACITOR | Mar 17, 2008 | Abandoned |
Array
(
[id] => 5530621
[patent_doc_number] => 20090230409
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-17
[patent_title] => 'UNDERFILL PROCESS FOR FLIP-CHIP LEDS'
[patent_app_type] => utility
[patent_app_number] => 12/050082
[patent_app_country] => US
[patent_app_date] => 2008-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3510
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20090230409.pdf
[firstpage_image] =>[orig_patent_app_number] => 12050082
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/050082 | UNDERFILL PROCESS FOR FLIP-CHIP LEDS | Mar 16, 2008 | Abandoned |
Array
(
[id] => 5319818
[patent_doc_number] => 20090057808
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-05
[patent_title] => 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND SUBSTRATE'
[patent_app_type] => utility
[patent_app_number] => 12/046535
[patent_app_country] => US
[patent_app_date] => 2008-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 10034
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0057/20090057808.pdf
[firstpage_image] =>[orig_patent_app_number] => 12046535
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/046535 | Semiconductor device, semiconductor element, and substrate | Mar 11, 2008 | Issued |
Array
(
[id] => 4816986
[patent_doc_number] => 20080224245
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-18
[patent_title] => 'IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/046091
[patent_app_country] => US
[patent_app_date] => 2008-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3033
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20080224245.pdf
[firstpage_image] =>[orig_patent_app_number] => 12046091
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/046091 | Image sensor and method for manufacturing the same | Mar 10, 2008 | Issued |
Array
(
[id] => 5327782
[patent_doc_number] => 20090108259
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-30
[patent_title] => 'Pixel Structure and Method for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 12/040281
[patent_app_country] => US
[patent_app_date] => 2008-02-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 4650
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20090108259.pdf
[firstpage_image] =>[orig_patent_app_number] => 12040281
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/040281 | Pixel structure and method for manufacturing the same | Feb 28, 2008 | Issued |
Array
(
[id] => 4575303
[patent_doc_number] => 07859091
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-28
[patent_title] => 'Manufacturing methods for semiconductor device with sealed cap'
[patent_app_type] => utility
[patent_app_number] => 12/068771
[patent_app_country] => US
[patent_app_date] => 2008-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 56
[patent_no_of_words] => 15324
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/859/07859091.pdf
[firstpage_image] =>[orig_patent_app_number] => 12068771
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/068771 | Manufacturing methods for semiconductor device with sealed cap | Feb 11, 2008 | Issued |
Array
(
[id] => 133922
[patent_doc_number] => 07696612
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-13
[patent_title] => 'Multiphase synchronous buck converter'
[patent_app_type] => utility
[patent_app_number] => 12/020892
[patent_app_country] => US
[patent_app_date] => 2008-01-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 2809
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 281
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/696/07696612.pdf
[firstpage_image] =>[orig_patent_app_number] => 12020892
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/020892 | Multiphase synchronous buck converter | Jan 27, 2008 | Issued |
Array
(
[id] => 4749061
[patent_doc_number] => 20080157132
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'METHOD FOR FORMING THE GATE OF A TRANSISTOR'
[patent_app_type] => utility
[patent_app_number] => 11/953571
[patent_app_country] => US
[patent_app_date] => 2007-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 1782
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157132.pdf
[firstpage_image] =>[orig_patent_app_number] => 11953571
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/953571 | METHOD FOR FORMING THE GATE OF A TRANSISTOR | Dec 9, 2007 | Abandoned |
Array
(
[id] => 6336965
[patent_doc_number] => 20100019394
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-28
[patent_title] => 'IC CHIP MOUNTING PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/312981
[patent_app_country] => US
[patent_app_date] => 2007-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 8756
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0019/20100019394.pdf
[firstpage_image] =>[orig_patent_app_number] => 12312981
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/312981 | IC chip package employing substrate with a device hole | Nov 29, 2007 | Issued |