
Akm Zakaria
Examiner (ID: 10697, Phone: (571)270-0664 , Office: P/2868 )
| Most Active Art Unit | 2868 |
| Art Unit(s) | 2868, 2858 |
| Total Applications | 868 |
| Issued Applications | 650 |
| Pending Applications | 101 |
| Abandoned Applications | 136 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7577422
[patent_doc_number] => 20110291304
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-12-01
[patent_title] => 'METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD'
[patent_app_type] => utility
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Array
(
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[patent_doc_number] => 20120032224
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[patent_issue_date] => 2012-02-09
[patent_title] => 'ELECTRICAL CONNECTION STRUCTURE AND LIGHT EMITTING DIODE MODULE, FABRIC CIRCUITS, AND SIGNAL TEXTILE HAVING THE SAME'
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Array
(
[id] => 8414435
[patent_doc_number] => 20120241935
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[patent_kind] => A1
[patent_issue_date] => 2012-09-27
[patent_title] => 'PACKAGE-ON-PACKAGE STRUCTURE'
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Array
(
[id] => 7805226
[patent_doc_number] => 20120056178
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-08
[patent_title] => 'MULTI-CHIP PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 13/205916
[patent_app_country] => US
[patent_app_date] => 2011-08-09
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Array
(
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[patent_title] => 'STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS'
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Array
(
[id] => 8657102
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[patent_issue_date] => 2013-02-14
[patent_title] => 'SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING'
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Array
(
[id] => 7567521
[patent_doc_number] => 20110287584
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[patent_kind] => A1
[patent_issue_date] => 2011-11-24
[patent_title] => 'SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/197249
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/197249 | SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME | Aug 2, 2011 | Abandoned |
Array
(
[id] => 8647222
[patent_doc_number] => 20130032952
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[patent_kind] => A1
[patent_issue_date] => 2013-02-07
[patent_title] => 'Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die'
[patent_app_type] => utility
[patent_app_number] => 13/195636
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Array
(
[id] => 8647205
[patent_doc_number] => 20130032934
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[patent_issue_date] => 2013-02-07
[patent_title] => 'PACKAGED MICROELECTRONIC ELEMENTS HAVING BLIND VIAS FOR HEAT DISSIPATION'
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[patent_app_number] => 13/195786
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/195786 | Packaged microelectronic elements having blind vias for heat dissipation | Jul 31, 2011 | Issued |
Array
(
[id] => 8368238
[patent_doc_number] => 20120217627
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[patent_title] => 'PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME'
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Array
(
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Array
(
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Array
(
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Array
(
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Array
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Array
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Array
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