Search

Alan A. Mathews

Examiner (ID: 18301)

Most Active Art Unit
2101
Art Unit(s)
2851, 2203, 2101, 2882
Total Applications
2349
Issued Applications
2176
Pending Applications
25
Abandoned Applications
148

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18812713 [patent_doc_number] => 20230387050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => POLYIMIDE PROFILE CONTROL [patent_app_type] => utility [patent_app_number] => 18/446834 [patent_app_country] => US [patent_app_date] => 2023-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7806 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18446834 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/446834
Polyimide profile control Aug 8, 2023 Issued
Array ( [id] => 19773427 [patent_doc_number] => 20250054853 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-13 [patent_title] => SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/231498 [patent_app_country] => US [patent_app_date] => 2023-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8261 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18231498 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/231498
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES Aug 7, 2023 Pending
Array ( [id] => 18848914 [patent_doc_number] => 20230411318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => Semiconductor Device and Method [patent_app_type] => utility [patent_app_number] => 18/231032 [patent_app_country] => US [patent_app_date] => 2023-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9936 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18231032 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/231032
Semiconductor device and method Aug 6, 2023 Issued
Array ( [id] => 19589873 [patent_doc_number] => 20240387430 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/365667 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9583 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18365667 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/365667
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME Aug 3, 2023 Pending
Array ( [id] => 19589873 [patent_doc_number] => 20240387430 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/365667 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9583 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18365667 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/365667
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME Aug 3, 2023 Pending
Array ( [id] => 19285767 [patent_doc_number] => 20240222244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/230416 [patent_app_country] => US [patent_app_date] => 2023-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5853 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18230416 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/230416
SEMICONDUCTOR PACKAGE Aug 3, 2023 Pending
Array ( [id] => 19191518 [patent_doc_number] => 20240170431 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-23 [patent_title] => BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PACKAGE DEVICE, AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/228746 [patent_app_country] => US [patent_app_date] => 2023-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5706 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18228746 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/228746
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PACKAGE DEVICE, AND METHOD FOR MANUFACTURING THE SAME Jul 31, 2023 Pending
Array ( [id] => 19749573 [patent_doc_number] => 20250038138 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-30 [patent_title] => SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 18/359945 [patent_app_country] => US [patent_app_date] => 2023-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4130 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359945 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359945
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYER AND METHOD THEREFOR Jul 26, 2023 Pending
Array ( [id] => 18774362 [patent_doc_number] => 20230369193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => Package Substrate Insulation Opening Design [patent_app_type] => utility [patent_app_number] => 18/357757 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6518 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357757 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/357757
Package substrate insulation opening design Jul 23, 2023 Issued
Array ( [id] => 18774362 [patent_doc_number] => 20230369193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => Package Substrate Insulation Opening Design [patent_app_type] => utility [patent_app_number] => 18/357757 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6518 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357757 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/357757
Package substrate insulation opening design Jul 23, 2023 Issued
Array ( [id] => 18774546 [patent_doc_number] => 20230369377 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => METHOD FOR FORMING AN IMAGE SENSOR [patent_app_type] => utility [patent_app_number] => 18/354859 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12996 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354859 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354859
Method for forming an image sensor Jul 18, 2023 Issued
Array ( [id] => 19696479 [patent_doc_number] => 20250015024 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS [patent_app_type] => utility [patent_app_number] => 18/346701 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10366 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346701 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/346701
INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS Jul 2, 2023 Pending
Array ( [id] => 19116460 [patent_doc_number] => 20240128210 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => Thermally Conductive IC Spacer with Integrated Electrical Isolation [patent_app_type] => utility [patent_app_number] => 18/217039 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6206 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217039 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/217039
Thermally Conductive IC Spacer with Integrated Electrical Isolation Jun 29, 2023 Pending
Array ( [id] => 18898633 [patent_doc_number] => 20240014118 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => FLIP CHIP PACKAGE AND SUBSTRATE THEREOF [patent_app_type] => utility [patent_app_number] => 18/214572 [patent_app_country] => US [patent_app_date] => 2023-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2416 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214572 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/214572
Flip chip package and substrate thereof Jun 26, 2023 Issued
Array ( [id] => 19781558 [patent_doc_number] => 12230596 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-18 [patent_title] => Electronics assemblies employing copper in multiple locations [patent_app_type] => utility [patent_app_number] => 18/339865 [patent_app_country] => US [patent_app_date] => 2023-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 23287 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18339865 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/339865
Electronics assemblies employing copper in multiple locations Jun 21, 2023 Issued
Array ( [id] => 18906096 [patent_doc_number] => 20240021581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/212453 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7963 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212453
SEMICONDUCTOR PACKAGE Jun 20, 2023 Pending
Array ( [id] => 18906096 [patent_doc_number] => 20240021581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/212453 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7963 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212453
SEMICONDUCTOR PACKAGE Jun 20, 2023 Pending
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