Search

Alan A. Mathews

Examiner (ID: 18301)

Most Active Art Unit
2101
Art Unit(s)
2851, 2203, 2101, 2882
Total Applications
2349
Issued Applications
2176
Pending Applications
25
Abandoned Applications
148

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18906096 [patent_doc_number] => 20240021581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/212453 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7963 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212453
SEMICONDUCTOR PACKAGE Jun 20, 2023 Pending
Array ( [id] => 19733812 [patent_doc_number] => 12211814 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-28 [patent_title] => Semiconductor interconnect structures with conductive elements, and associated systems and methods [patent_app_type] => utility [patent_app_number] => 18/212665 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 26 [patent_no_of_words] => 6849 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212665 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212665
Semiconductor interconnect structures with conductive elements, and associated systems and methods Jun 20, 2023 Issued
Array ( [id] => 18906096 [patent_doc_number] => 20240021581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/212453 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7963 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212453
SEMICONDUCTOR PACKAGE Jun 20, 2023 Pending
Array ( [id] => 18906096 [patent_doc_number] => 20240021581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/212453 [patent_app_country] => US [patent_app_date] => 2023-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7963 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/212453
SEMICONDUCTOR PACKAGE Jun 20, 2023 Pending
Array ( [id] => 19414864 [patent_doc_number] => 12080701 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/210132 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 9197 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210132 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/210132
Semiconductor package Jun 14, 2023 Issued
Array ( [id] => 20435045 [patent_doc_number] => 12506099 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-23 [patent_title] => Semiconductor package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/327831 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 36 [patent_no_of_words] => 8011 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327831 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327831
Semiconductor package and manufacturing method thereof May 31, 2023 Issued
Array ( [id] => 18661388 [patent_doc_number] => 20230307402 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 18/327178 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3723 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327178 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327178
SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR May 31, 2023 Abandoned
Array ( [id] => 18661371 [patent_doc_number] => 20230307385 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/325136 [patent_app_country] => US [patent_app_date] => 2023-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9869 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325136 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/325136
Semiconductor package May 29, 2023 Issued
Array ( [id] => 18661314 [patent_doc_number] => 20230307327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => CONDUCTIVE MEMBER CAVITIES [patent_app_type] => utility [patent_app_number] => 18/324673 [patent_app_country] => US [patent_app_date] => 2023-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4744 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324673 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/324673
Conductive member cavities May 25, 2023 Issued
Array ( [id] => 19604794 [patent_doc_number] => 20240395674 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-28 [patent_title] => SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR [patent_app_type] => utility [patent_app_number] => 18/322658 [patent_app_country] => US [patent_app_date] => 2023-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3522 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322658 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/322658
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR May 23, 2023 Pending
Array ( [id] => 19575279 [patent_doc_number] => 20240379571 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-14 [patent_title] => SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY [patent_app_type] => utility [patent_app_number] => 18/195058 [patent_app_country] => US [patent_app_date] => 2023-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5980 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195058 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/195058
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY May 8, 2023 Pending
Array ( [id] => 18600251 [patent_doc_number] => 20230275052 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/313560 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9632 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313560 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313560
Semiconductor devices and semiconductor packages including the same May 7, 2023 Issued
Array ( [id] => 18570600 [patent_doc_number] => 20230260937 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/138752 [patent_app_country] => US [patent_app_date] => 2023-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1602 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138752 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/138752
Semiconductor device and method for fabricating the same Apr 24, 2023 Issued
Array ( [id] => 20405719 [patent_doc_number] => 12495710 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Display device [patent_app_type] => utility [patent_app_number] => 18/118865 [patent_app_country] => US [patent_app_date] => 2023-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 6825 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18118865 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/118865
Display device Mar 7, 2023 Issued
Array ( [id] => 19261053 [patent_doc_number] => 12021120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-25 [patent_title] => SiC semiconductor device [patent_app_type] => utility [patent_app_number] => 18/180599 [patent_app_country] => US [patent_app_date] => 2023-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 64 [patent_figures_cnt] => 66 [patent_no_of_words] => 76463 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18180599 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/180599
SiC semiconductor device Mar 7, 2023 Issued
Array ( [id] => 20405719 [patent_doc_number] => 12495710 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Display device [patent_app_type] => utility [patent_app_number] => 18/118865 [patent_app_country] => US [patent_app_date] => 2023-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 6825 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18118865 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/118865
Display device Mar 7, 2023 Issued
Array ( [id] => 18473219 [patent_doc_number] => 20230207507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => Superconducting Bump Bonds for Quantum Computing Systems [patent_app_type] => utility [patent_app_number] => 18/177876 [patent_app_country] => US [patent_app_date] => 2023-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13719 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18177876 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/177876
Superconducting bump bonds for quantum computing systems Mar 2, 2023 Issued
Array ( [id] => 18851213 [patent_doc_number] => 20230413617 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/170204 [patent_app_country] => US [patent_app_date] => 2023-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11315 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18170204 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/170204
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME Feb 15, 2023 Pending
Array ( [id] => 18440034 [patent_doc_number] => 20230187329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/167369 [patent_app_country] => US [patent_app_date] => 2023-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7426 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18167369 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/167369
Semiconductor package Feb 9, 2023 Issued
Array ( [id] => 19314471 [patent_doc_number] => 12040297 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-16 [patent_title] => Methods of manufacturing semiconductor packages [patent_app_type] => utility [patent_app_number] => 18/166869 [patent_app_country] => US [patent_app_date] => 2023-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 6628 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18166869 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/166869
Methods of manufacturing semiconductor packages Feb 8, 2023 Issued
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