
Alan A. Mathews
Examiner (ID: 18301)
| Most Active Art Unit | 2101 |
| Art Unit(s) | 2851, 2203, 2101, 2882 |
| Total Applications | 2349 |
| Issued Applications | 2176 |
| Pending Applications | 25 |
| Abandoned Applications | 148 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18906096
[patent_doc_number] => 20240021581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/212453
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7963
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212453 | SEMICONDUCTOR PACKAGE | Jun 20, 2023 | Pending |
Array
(
[id] => 19733812
[patent_doc_number] => 12211814
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-01-28
[patent_title] => Semiconductor interconnect structures with conductive elements, and associated systems and methods
[patent_app_type] => utility
[patent_app_number] => 18/212665
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 26
[patent_no_of_words] => 6849
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212665
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212665 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Jun 20, 2023 | Issued |
Array
(
[id] => 18906096
[patent_doc_number] => 20240021581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/212453
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7963
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212453 | SEMICONDUCTOR PACKAGE | Jun 20, 2023 | Pending |
Array
(
[id] => 18906096
[patent_doc_number] => 20240021581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/212453
[patent_app_country] => US
[patent_app_date] => 2023-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7963
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18212453
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/212453 | SEMICONDUCTOR PACKAGE | Jun 20, 2023 | Pending |
Array
(
[id] => 19414864
[patent_doc_number] => 12080701
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-03
[patent_title] => Semiconductor package
[patent_app_type] => utility
[patent_app_number] => 18/210132
[patent_app_country] => US
[patent_app_date] => 2023-06-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 26
[patent_no_of_words] => 9197
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18210132
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/210132 | Semiconductor package | Jun 14, 2023 | Issued |
Array
(
[id] => 20435045
[patent_doc_number] => 12506099
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-23
[patent_title] => Semiconductor package and manufacturing method thereof
[patent_app_type] => utility
[patent_app_number] => 18/327831
[patent_app_country] => US
[patent_app_date] => 2023-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 36
[patent_figures_cnt] => 36
[patent_no_of_words] => 8011
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327831
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/327831 | Semiconductor package and manufacturing method thereof | May 31, 2023 | Issued |
Array
(
[id] => 18661388
[patent_doc_number] => 20230307402
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR
[patent_app_type] => utility
[patent_app_number] => 18/327178
[patent_app_country] => US
[patent_app_date] => 2023-06-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3723
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327178
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/327178 | SEMICONDUCTOR DEVICE UNDER BUMP STRUCTURE AND METHOD THEREFOR | May 31, 2023 | Abandoned |
Array
(
[id] => 18661371
[patent_doc_number] => 20230307385
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/325136
[patent_app_country] => US
[patent_app_date] => 2023-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9869
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325136
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/325136 | Semiconductor package | May 29, 2023 | Issued |
Array
(
[id] => 18661314
[patent_doc_number] => 20230307327
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => CONDUCTIVE MEMBER CAVITIES
[patent_app_type] => utility
[patent_app_number] => 18/324673
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4744
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324673
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/324673 | Conductive member cavities | May 25, 2023 | Issued |
Array
(
[id] => 19604794
[patent_doc_number] => 20240395674
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-28
[patent_title] => SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR
[patent_app_type] => utility
[patent_app_number] => 18/322658
[patent_app_country] => US
[patent_app_date] => 2023-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3522
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322658
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/322658 | SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD THEREFOR | May 23, 2023 | Pending |
Array
(
[id] => 19575279
[patent_doc_number] => 20240379571
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-14
[patent_title] => SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY
[patent_app_type] => utility
[patent_app_number] => 18/195058
[patent_app_country] => US
[patent_app_date] => 2023-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5980
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 77
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18195058
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/195058 | SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY | May 8, 2023 | Pending |
Array
(
[id] => 18600251
[patent_doc_number] => 20230275052
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-31
[patent_title] => SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/313560
[patent_app_country] => US
[patent_app_date] => 2023-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9632
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313560
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/313560 | Semiconductor devices and semiconductor packages including the same | May 7, 2023 | Issued |
Array
(
[id] => 18570600
[patent_doc_number] => 20230260937
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/138752
[patent_app_country] => US
[patent_app_date] => 2023-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1602
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -7
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138752
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/138752 | Semiconductor device and method for fabricating the same | Apr 24, 2023 | Issued |
Array
(
[id] => 20405719
[patent_doc_number] => 12495710
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-09
[patent_title] => Display device
[patent_app_type] => utility
[patent_app_number] => 18/118865
[patent_app_country] => US
[patent_app_date] => 2023-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 6825
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18118865
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/118865 | Display device | Mar 7, 2023 | Issued |
Array
(
[id] => 19261053
[patent_doc_number] => 12021120
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-25
[patent_title] => SiC semiconductor device
[patent_app_type] => utility
[patent_app_number] => 18/180599
[patent_app_country] => US
[patent_app_date] => 2023-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 64
[patent_figures_cnt] => 66
[patent_no_of_words] => 76463
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18180599
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/180599 | SiC semiconductor device | Mar 7, 2023 | Issued |
Array
(
[id] => 20405719
[patent_doc_number] => 12495710
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-09
[patent_title] => Display device
[patent_app_type] => utility
[patent_app_number] => 18/118865
[patent_app_country] => US
[patent_app_date] => 2023-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 6825
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18118865
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/118865 | Display device | Mar 7, 2023 | Issued |
Array
(
[id] => 18473219
[patent_doc_number] => 20230207507
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => Superconducting Bump Bonds for Quantum Computing Systems
[patent_app_type] => utility
[patent_app_number] => 18/177876
[patent_app_country] => US
[patent_app_date] => 2023-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13719
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18177876
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/177876 | Superconducting bump bonds for quantum computing systems | Mar 2, 2023 | Issued |
Array
(
[id] => 18851213
[patent_doc_number] => 20230413617
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-21
[patent_title] => DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/170204
[patent_app_country] => US
[patent_app_date] => 2023-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11315
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 93
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18170204
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/170204 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Feb 15, 2023 | Pending |
Array
(
[id] => 18440034
[patent_doc_number] => 20230187329
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-15
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/167369
[patent_app_country] => US
[patent_app_date] => 2023-02-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7426
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18167369
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/167369 | Semiconductor package | Feb 9, 2023 | Issued |
Array
(
[id] => 19314471
[patent_doc_number] => 12040297
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-16
[patent_title] => Methods of manufacturing semiconductor packages
[patent_app_type] => utility
[patent_app_number] => 18/166869
[patent_app_country] => US
[patent_app_date] => 2023-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 6628
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18166869
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/166869 | Methods of manufacturing semiconductor packages | Feb 8, 2023 | Issued |