Alexander G. Ghyka

Array ( [id] => 9401552 [patent_doc_number] => 08691604 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-08 [patent_title] => 'Semiconductor device and manufacturing method thereof, delamination method, and transferring method' [patent_app_type] => utility [patent_app_number] => 13/587111 [patent_app_country] => US [patent_app_date] => 2012-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 32 [patent_figures_cnt] => 71 [patent_no_of_words] => 9570 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13587111 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8649202 [patent_doc_number] => 20130034932 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-07 [patent_title] => 'Thin-Film Devices Formed From Solid Group IIIA Particles' [patent_app_type] => utility [patent_app_number] => 13/571685 [patent_app_country] => US [patent_app_date] => 2012-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 39296 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13571685 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10848636 [patent_doc_number] => RE045232 [patent_country] => US [patent_kind] => E1 [patent_issue_date] => 2014-11-04 [patent_title] => 'Method of forming a contact plug for a semiconductor device' [patent_app_type] => reissue [patent_app_number] => 13/568920 [patent_app_country] => US [patent_app_date] => 2012-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 2480 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13568920 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8495972 [patent_doc_number] => 20120295380 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-22 [patent_title] => 'ETCHANT AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/566239 [patent_app_country] => US [patent_app_date] => 2012-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5745 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13566239 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8846124 [patent_doc_number] => 08455303 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-04 [patent_title] => 'Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method' [patent_app_type] => utility [patent_app_number] => 13/545225 [patent_app_country] => US [patent_app_date] => 2012-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 41 [patent_no_of_words] => 8776 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13545225 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9311738 [patent_doc_number] => 08652956 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-18 [patent_title] => 'High-k metal gate electrode structures formed by separate removal of placeholder materials using a masking regime prior to gate patterning' [patent_app_type] => utility [patent_app_number] => 13/533807 [patent_app_country] => US [patent_app_date] => 2012-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 10935 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13533807 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9824028 [patent_doc_number] => 08933515 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-13 [patent_title] => 'Device structure, layout and fabrication method for uniaxially strained transistors' [patent_app_type] => utility [patent_app_number] => 13/531175 [patent_app_country] => US [patent_app_date] => 2012-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 3928 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13531175 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9198314 [patent_doc_number] => 20130337629 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-12-19 [patent_title] => 'METHOD OF FABRICATING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/523912 [patent_app_country] => US [patent_app_date] => 2012-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4664 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13523912 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8522780 [patent_doc_number] => 20120322188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-20 [patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 13/523571 [patent_app_country] => US [patent_app_date] => 2012-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4920 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13523571 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8403090 [patent_doc_number] => 20120235140 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-20 [patent_title] => 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/483423 [patent_app_country] => US [patent_app_date] => 2012-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 25262 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13483423 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8370708 [patent_doc_number] => 20120220096 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-30 [patent_title] => 'PLASMA DOPING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/469229 [patent_app_country] => US [patent_app_date] => 2012-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 11073 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13469229 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9503457 [patent_doc_number] => 08741770 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-03 [patent_title] => 'Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process' [patent_app_type] => utility [patent_app_number] => 13/468083 [patent_app_country] => US [patent_app_date] => 2012-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 13394 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13468083 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8310477 [patent_doc_number] => 20120187503 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-07-26 [patent_title] => 'SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/427090 [patent_app_country] => US [patent_app_date] => 2012-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 10998 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13427090 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8310544 [patent_doc_number] => 20120187570 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-07-26 [patent_title] => 'HYBRID BONDING TECHNIQUES FOR MULTI-LAYER SEMICONDUCTOR STACKS' [patent_app_type] => utility [patent_app_number] => 13/422606 [patent_app_country] => US [patent_app_date] => 2012-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 12090 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13422606 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8261720 [patent_doc_number] => 20120161151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-06-28 [patent_title] => 'SOLID STATE LIGHTING DEVICES AND ASSOCIATED METHODS OF MANUFACTURING' [patent_app_type] => utility [patent_app_number] => 13/412388 [patent_app_country] => US [patent_app_date] => 2012-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3002 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13412388 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9245880 [patent_doc_number] => 08610163 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-12-17 [patent_title] => 'Method for manufacturing semiconductor light emitting device' [patent_app_type] => utility [patent_app_number] => 13/406840 [patent_app_country] => US [patent_app_date] => 2012-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 19 [patent_no_of_words] => 5383 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13406840 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8359151 [patent_doc_number] => 20120214316 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-23 [patent_title] => 'SEMICONDUCTOR DEVICES HAVING PLANARIZED INSULATION LAYERS AND METHODS OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/398895 [patent_app_country] => US [patent_app_date] => 2012-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3429 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13398895 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8356726 [patent_doc_number] => 20120211886 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-23 [patent_title] => 'Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the Method' [patent_app_type] => utility [patent_app_number] => 13/399051 [patent_app_country] => US [patent_app_date] => 2012-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3897 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13399051 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10581060 [patent_doc_number] => 09303178 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-05 [patent_title] => 'Suspensions for protecting semiconductor materials and methods for producing semiconductor bodies' [patent_app_type] => utility [patent_app_number] => 13/398992 [patent_app_country] => US [patent_app_date] => 2012-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3104 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13398992 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8496027 [patent_doc_number] => 20120295435 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-22 [patent_title] => 'PATTERN TRANSFER METHOD' [patent_app_type] => utility [patent_app_number] => 13/399016 [patent_app_country] => US [patent_app_date] => 2012-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4205 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13399016 [rel_patent_id] =>[rel_patent_doc_number] =>)