Search

Alexander O Williams

Examiner (ID: 106, Phone: (571)272-1924 , Office: P/2826 )

Most Active Art Unit
2826
Art Unit(s)
2826, 2508, 2811
Total Applications
2764
Issued Applications
2317
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18363440 [patent_doc_number] => 20230145031 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND WAFER STACKING METHOD [patent_app_type] => utility [patent_app_number] => 17/732324 [patent_app_country] => US [patent_app_date] => 2022-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6284 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17732324 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/732324
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND WAFER STACKING METHOD Apr 27, 2022 Pending
Array ( [id] => 18729376 [patent_doc_number] => 20230343672 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING [patent_app_type] => utility [patent_app_number] => 17/728586 [patent_app_country] => US [patent_app_date] => 2022-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4624 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17728586 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/728586
METHODS AND APPARATUS FOR INTEGRATING CARBON NANOFIBER INTO SEMICONDUCTOR DEVICES USING W2W FUSION BONDING Apr 24, 2022
Array ( [id] => 17780136 [patent_doc_number] => 20220246486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 17/660319 [patent_app_country] => US [patent_app_date] => 2022-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2443 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17660319 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/660319
SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS Apr 21, 2022 Pending
Array ( [id] => 17780310 [patent_doc_number] => 20220246660 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => SEMICONDUCTOR PACKAGE AND RELATED METHODS [patent_app_type] => utility [patent_app_number] => 17/659885 [patent_app_country] => US [patent_app_date] => 2022-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5617 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17659885 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/659885
SEMICONDUCTOR PACKAGE AND RELATED METHODS Apr 19, 2022 Pending
Array ( [id] => 17753060 [patent_doc_number] => 20220231265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-21 [patent_title] => Display Assembly Apparatus And Methods For Information Handling Systems [patent_app_type] => utility [patent_app_number] => 17/714978 [patent_app_country] => US [patent_app_date] => 2022-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8878 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17714978 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/714978
Display Assembly Apparatus And Methods For Information Handling Systems Apr 5, 2022 Pending
Array ( [id] => 18967514 [patent_doc_number] => 11901295 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Dielectric film for semiconductor fabrication [patent_app_type] => utility [patent_app_number] => 17/712306 [patent_app_country] => US [patent_app_date] => 2022-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 5519 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17712306 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/712306
Dielectric film for semiconductor fabrication Apr 3, 2022 Issued
Array ( [id] => 18024311 [patent_doc_number] => 20220375810 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 17/700532 [patent_app_country] => US [patent_app_date] => 2022-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10118 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17700532 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/700532
SEMICONDUCTOR MODULE Mar 21, 2022 Pending
Array ( [id] => 18653183 [patent_doc_number] => 20230299023 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/698545 [patent_app_country] => US [patent_app_date] => 2022-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11448 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17698545 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/698545
Semiconductor device with composite conductive features and method for fabricating the same Mar 17, 2022 Issued
Array ( [id] => 18113081 [patent_doc_number] => 20230005961 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME [patent_app_type] => utility [patent_app_number] => 17/692371 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12865 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17692371 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/692371
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME Mar 10, 2022 Pending
Array ( [id] => 18967488 [patent_doc_number] => 11901269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/687072 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 19 [patent_no_of_words] => 10472 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687072 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687072
Semiconductor package Mar 3, 2022 Issued
Array ( [id] => 17949282 [patent_doc_number] => 20220336301 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS [patent_app_type] => utility [patent_app_number] => 17/683002 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10567 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683002 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/683002
Power semiconductor device, method for manufacturing power semiconductor device, and power conversion apparatus Feb 27, 2022 Issued
Array ( [id] => 18840158 [patent_doc_number] => 11848237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-19 [patent_title] => Composite wafer, semiconductor device and electronic component [patent_app_type] => utility [patent_app_number] => 17/678619 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 57 [patent_no_of_words] => 16808 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678619 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678619
Composite wafer, semiconductor device and electronic component Feb 22, 2022 Issued
Array ( [id] => 18142342 [patent_doc_number] => 20230016186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-19 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/678392 [patent_app_country] => US [patent_app_date] => 2022-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9269 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17678392 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/678392
Semiconductor device and method for manufacturing the same Feb 22, 2022 Issued
Array ( [id] => 19138070 [patent_doc_number] => 11973045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-30 [patent_title] => Semiconductor structure and method for forming same [patent_app_type] => utility [patent_app_number] => 17/650796 [patent_app_country] => US [patent_app_date] => 2022-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 5093 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650796 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/650796
Semiconductor structure and method for forming same Feb 10, 2022 Issued
Array ( [id] => 18284384 [patent_doc_number] => 20230099856 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM [patent_app_type] => utility [patent_app_number] => 17/665749 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9877 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665749 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/665749
Integrated circuit package module including a bonding system Feb 6, 2022 Issued
Array ( [id] => 18024314 [patent_doc_number] => 20220375813 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-24 [patent_title] => ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/583946 [patent_app_country] => US [patent_app_date] => 2022-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8102 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17583946 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/583946
ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF Jan 24, 2022 Pending
Array ( [id] => 18112969 [patent_doc_number] => 20230005849 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/648309 [patent_app_country] => US [patent_app_date] => 2022-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7204 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17648309 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/648309
Semiconductor structure and manufacturing method thereof Jan 18, 2022 Issued
Array ( [id] => 17917566 [patent_doc_number] => 20220319962 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/577091 [patent_app_country] => US [patent_app_date] => 2022-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9793 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577091 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/577091
Semiconductor device Jan 16, 2022 Issued
Array ( [id] => 17583041 [patent_doc_number] => 20220139896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE [patent_app_type] => utility [patent_app_number] => 17/574485 [patent_app_country] => US [patent_app_date] => 2022-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15663 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17574485 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/574485
Distributed semiconductor die and package architecture Jan 11, 2022 Issued
Array ( [id] => 18211297 [patent_doc_number] => 20230057560 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/572033 [patent_app_country] => US [patent_app_date] => 2022-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4836 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572033 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/572033
SEMICONDUCTOR DEVICE INCLUDING RE-DISTRIBUTION PADS DISPOSED AT DIFFERENT LEVELS AND A METHOD OF MANUFACTURING THE SAME Jan 9, 2022 Pending
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