Search

Alexander O Williams

Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 10758514 [patent_doc_number] => 20160104666 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-04-14 [patent_title] => 'POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURING SAME' [patent_app_type] => utility [patent_app_number] => 14/512562 [patent_app_country] => US [patent_app_date] => 2014-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5889 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14512562 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/512562
Power overlay structure having wirebonds and method of manufacturing same Oct 12, 2014 Issued
Array ( [id] => 11508953 [patent_doc_number] => 09600112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-21 [patent_title] => 'Signal trace patterns for flexible substrates' [patent_app_type] => utility [patent_app_number] => 14/511945 [patent_app_country] => US [patent_app_date] => 2014-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 32 [patent_no_of_words] => 4838 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14511945 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/511945
Signal trace patterns for flexible substrates Oct 9, 2014 Issued
Array ( [id] => 11797006 [patent_doc_number] => 09406862 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-08-02 [patent_title] => 'Elastic wave device including multilayer metal film' [patent_app_type] => utility [patent_app_number] => 14/510226 [patent_app_country] => US [patent_app_date] => 2014-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4690 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14510226 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/510226
Elastic wave device including multilayer metal film Oct 8, 2014 Issued
Array ( [id] => 11770023 [patent_doc_number] => 09378702 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-06-28 [patent_title] => 'Electronic device using method, electronic device and electronic apparatus adapted to switch operating modes' [patent_app_type] => utility [patent_app_number] => 14/509057 [patent_app_country] => US [patent_app_date] => 2014-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 16 [patent_no_of_words] => 5954 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14509057 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/509057
Electronic device using method, electronic device and electronic apparatus adapted to switch operating modes Oct 7, 2014 Issued
Array ( [id] => 10310905 [patent_doc_number] => 20150195907 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-07-09 [patent_title] => 'MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/509603 [patent_app_country] => US [patent_app_date] => 2014-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5222 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14509603 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/509603
MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Oct 7, 2014 Abandoned
Array ( [id] => 10758516 [patent_doc_number] => 20160104668 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-04-14 [patent_title] => 'POP JOINT THROUGH INTERPOSER' [patent_app_type] => utility [patent_app_number] => 14/509815 [patent_app_country] => US [patent_app_date] => 2014-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4790 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14509815 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/509815
Pop joint through interposer Oct 7, 2014 Issued
Array ( [id] => 11483306 [patent_doc_number] => 09589860 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-03-07 [patent_title] => 'Electronic devices with semiconductor die coupled to a thermally conductive substrate' [patent_app_type] => utility [patent_app_number] => 14/508645 [patent_app_country] => US [patent_app_date] => 2014-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 8698 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14508645 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/508645
Electronic devices with semiconductor die coupled to a thermally conductive substrate Oct 6, 2014 Issued
Array ( [id] => 10315147 [patent_doc_number] => 20150200150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-07-16 [patent_title] => 'Thermal Management In Electronic Apparatus With Phase-Change Material And Silicon Heat Sink' [patent_app_type] => utility [patent_app_number] => 14/507794 [patent_app_country] => US [patent_app_date] => 2014-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 11464 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14507794 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/507794
Thermal management in electronic apparatus with phase-change material and silicon heat sink Oct 5, 2014 Issued
Array ( [id] => 10207369 [patent_doc_number] => 20150092357 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-02 [patent_title] => 'PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/504969 [patent_app_country] => US [patent_app_date] => 2014-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4746 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14504969 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/504969
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE Oct 1, 2014 Abandoned
Array ( [id] => 10753076 [patent_doc_number] => 20160099228 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-04-07 [patent_title] => 'METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT' [patent_app_type] => utility [patent_app_number] => 14/505307 [patent_app_country] => US [patent_app_date] => 2014-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7062 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14505307 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/505307
Semiconductor device with at least one voltage-guided conductive filament Oct 1, 2014 Issued
Array ( [id] => 11802359 [patent_doc_number] => 09543259 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-01-10 [patent_title] => 'Semiconductor structure with oval shaped conductor' [patent_app_type] => utility [patent_app_number] => 14/504053 [patent_app_country] => US [patent_app_date] => 2014-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 5872 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14504053 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/504053
Semiconductor structure with oval shaped conductor Sep 30, 2014 Issued
Array ( [id] => 10486735 [patent_doc_number] => 20150371755 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-24 [patent_title] => 'MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/504107 [patent_app_country] => US [patent_app_date] => 2014-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3006 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14504107 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/504107
Multilayer electronic component having conductive patterns and board having the same Sep 30, 2014 Issued
Array ( [id] => 10294553 [patent_doc_number] => 20150179552 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-25 [patent_title] => 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/501592 [patent_app_country] => US [patent_app_date] => 2014-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5084 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14501592 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/501592
Semiconductor package with an indented portion and manufacturing method thereof Sep 29, 2014 Issued
Array ( [id] => 10557053 [patent_doc_number] => 09281257 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-08 [patent_title] => 'Semiconductor package including a connecting member' [patent_app_type] => utility [patent_app_number] => 14/501577 [patent_app_country] => US [patent_app_date] => 2014-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3971 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14501577 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/501577
Semiconductor package including a connecting member Sep 29, 2014 Issued
Array ( [id] => 10745253 [patent_doc_number] => 20160091405 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-03-31 [patent_title] => 'METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-SOLID INTERFACE INTERACTION' [patent_app_type] => utility [patent_app_number] => 14/502897 [patent_app_country] => US [patent_app_date] => 2014-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4142 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14502897 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/502897
Method and integrated device for analyzing liquid flow and liquid-solid interface interaction Sep 29, 2014 Issued
Array ( [id] => 11063729 [patent_doc_number] => 20160260691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-09-08 [patent_title] => 'SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 14/912547 [patent_app_country] => US [patent_app_date] => 2014-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3503 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14912547 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/912547
SEMICONDUCTOR MODULE Aug 26, 2014 Abandoned
Array ( [id] => 10138577 [patent_doc_number] => 09171899 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-10-27 [patent_title] => 'Sapphire structure with a concave portion including a metal substructure and method for producing the same' [patent_app_type] => utility [patent_app_number] => 14/461623 [patent_app_country] => US [patent_app_date] => 2014-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 25 [patent_no_of_words] => 9215 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14461623 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/461623
Sapphire structure with a concave portion including a metal substructure and method for producing the same Aug 17, 2014 Issued
Array ( [id] => 14300933 [patent_doc_number] => 10290598 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-05-14 [patent_title] => Method and apparatus for forming backside die planar devices and saw filter [patent_app_type] => utility [patent_app_number] => 15/323521 [patent_app_country] => US [patent_app_date] => 2014-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 7564 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15323521 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/323521
Method and apparatus for forming backside die planar devices and saw filter Aug 6, 2014 Issued
Array ( [id] => 10583729 [patent_doc_number] => 09305855 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-05 [patent_title] => 'Semiconductor package devices including interposer openings for heat transfer member' [patent_app_type] => utility [patent_app_number] => 14/448794 [patent_app_country] => US [patent_app_date] => 2014-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 12943 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14448794 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/448794
Semiconductor package devices including interposer openings for heat transfer member Jul 30, 2014 Issued
Array ( [id] => 10553030 [patent_doc_number] => 09277678 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-01 [patent_title] => 'Multi-chip socket' [patent_app_type] => utility [patent_app_number] => 14/323614 [patent_app_country] => US [patent_app_date] => 2014-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3654 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14323614 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/323614
Multi-chip socket Jul 2, 2014 Issued
Menu