
Alexander O Williams
Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10758514
[patent_doc_number] => 20160104666
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-04-14
[patent_title] => 'POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 14/512562
[patent_app_country] => US
[patent_app_date] => 2014-10-13
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/512562 | Power overlay structure having wirebonds and method of manufacturing same | Oct 12, 2014 | Issued |
Array
(
[id] => 11508953
[patent_doc_number] => 09600112
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-03-21
[patent_title] => 'Signal trace patterns for flexible substrates'
[patent_app_type] => utility
[patent_app_number] => 14/511945
[patent_app_country] => US
[patent_app_date] => 2014-10-10
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/511945 | Signal trace patterns for flexible substrates | Oct 9, 2014 | Issued |
Array
(
[id] => 11797006
[patent_doc_number] => 09406862
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-02
[patent_title] => 'Elastic wave device including multilayer metal film'
[patent_app_type] => utility
[patent_app_number] => 14/510226
[patent_app_country] => US
[patent_app_date] => 2014-10-09
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/510226 | Elastic wave device including multilayer metal film | Oct 8, 2014 | Issued |
Array
(
[id] => 11770023
[patent_doc_number] => 09378702
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-06-28
[patent_title] => 'Electronic device using method, electronic device and electronic apparatus adapted to switch operating modes'
[patent_app_type] => utility
[patent_app_number] => 14/509057
[patent_app_country] => US
[patent_app_date] => 2014-10-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/509057 | Electronic device using method, electronic device and electronic apparatus adapted to switch operating modes | Oct 7, 2014 | Issued |
Array
(
[id] => 10310905
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[patent_issue_date] => 2015-07-09
[patent_title] => 'MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/509603 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | Oct 7, 2014 | Abandoned |
Array
(
[id] => 10758516
[patent_doc_number] => 20160104668
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-04-14
[patent_title] => 'POP JOINT THROUGH INTERPOSER'
[patent_app_type] => utility
[patent_app_number] => 14/509815
[patent_app_country] => US
[patent_app_date] => 2014-10-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/509815 | Pop joint through interposer | Oct 7, 2014 | Issued |
Array
(
[id] => 11483306
[patent_doc_number] => 09589860
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[patent_issue_date] => 2017-03-07
[patent_title] => 'Electronic devices with semiconductor die coupled to a thermally conductive substrate'
[patent_app_type] => utility
[patent_app_number] => 14/508645
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/508645 | Electronic devices with semiconductor die coupled to a thermally conductive substrate | Oct 6, 2014 | Issued |
Array
(
[id] => 10315147
[patent_doc_number] => 20150200150
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-07-16
[patent_title] => 'Thermal Management In Electronic Apparatus With Phase-Change Material And Silicon Heat Sink'
[patent_app_type] => utility
[patent_app_number] => 14/507794
[patent_app_country] => US
[patent_app_date] => 2014-10-06
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[patent_drawing_sheets_cnt] => 17
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14507794
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/507794 | Thermal management in electronic apparatus with phase-change material and silicon heat sink | Oct 5, 2014 | Issued |
Array
(
[id] => 10207369
[patent_doc_number] => 20150092357
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-04-02
[patent_title] => 'PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/504969
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/504969 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PACKAGE-ON-PACKAGE | Oct 1, 2014 | Abandoned |
Array
(
[id] => 10753076
[patent_doc_number] => 20160099228
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-04-07
[patent_title] => 'METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT'
[patent_app_type] => utility
[patent_app_number] => 14/505307
[patent_app_country] => US
[patent_app_date] => 2014-10-02
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/505307 | Semiconductor device with at least one voltage-guided conductive filament | Oct 1, 2014 | Issued |
Array
(
[id] => 11802359
[patent_doc_number] => 09543259
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[patent_issue_date] => 2017-01-10
[patent_title] => 'Semiconductor structure with oval shaped conductor'
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[patent_app_number] => 14/504053
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Array
(
[id] => 10486735
[patent_doc_number] => 20150371755
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[patent_issue_date] => 2015-12-24
[patent_title] => 'MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/504107 | Multilayer electronic component having conductive patterns and board having the same | Sep 30, 2014 | Issued |
Array
(
[id] => 10294553
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[patent_title] => 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/501592 | Semiconductor package with an indented portion and manufacturing method thereof | Sep 29, 2014 | Issued |
Array
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[id] => 10557053
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Array
(
[id] => 10745253
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[patent_title] => 'METHOD AND INTEGRATED DEVICE FOR ANALYZING LIQUID FLOW AND LIQUID-SOLID INTERFACE INTERACTION'
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Array
(
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Array
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[id] => 10138577
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/323614 | Multi-chip socket | Jul 2, 2014 | Issued |