
Alexander O Williams
Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9914395
[patent_doc_number] => 20150069599
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-03-12
[patent_title] => 'Power electronic switching device and assembly'
[patent_app_type] => utility
[patent_app_number] => 14/120385
[patent_app_country] => US
[patent_app_date] => 2014-05-14
[patent_effective_date] => 0000-00-00
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[patent_figures_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/120385 | Power electronic switching device and assembly | May 13, 2014 | Issued |
Array
(
[id] => 10260134
[patent_doc_number] => 20150145131
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-28
[patent_title] => 'SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/262537
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[patent_app_date] => 2014-04-25
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/262537 | Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same | Apr 24, 2014 | Issued |
Array
(
[id] => 10260119
[patent_doc_number] => 20150145116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-28
[patent_title] => 'DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS'
[patent_app_type] => utility
[patent_app_number] => 14/250317
[patent_app_country] => US
[patent_app_date] => 2014-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/250317 | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects | Apr 9, 2014 | Issued |
Array
(
[id] => 9639510
[patent_doc_number] => 20140217620
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-08-07
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/248406
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[patent_app_date] => 2014-04-09
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/248406 | Semiconductor device with resin mold | Apr 8, 2014 | Issued |
Array
(
[id] => 13653377
[patent_doc_number] => 09853009
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-12-26
[patent_title] => Semiconductor module having a conductor member for reducing thermal stress
[patent_app_type] => utility
[patent_app_number] => 15/126609
[patent_app_country] => US
[patent_app_date] => 2014-04-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/126609 | Semiconductor module having a conductor member for reducing thermal stress | Apr 3, 2014 | Issued |
Array
(
[id] => 11495403
[patent_doc_number] => 20170069589
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[patent_kind] => A1
[patent_issue_date] => 2017-03-09
[patent_title] => 'ANCHORED INTERCONNECT'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/120788 | Anchored interconnect | Mar 27, 2014 | Issued |
Array
(
[id] => 10277291
[patent_doc_number] => 20150162288
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-06-11
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/209535 | Semiconductor device | Mar 12, 2014 | Issued |
Array
(
[id] => 9905953
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[patent_country] => US
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[patent_issue_date] => 2015-03-05
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/203729
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/203729 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Mar 10, 2014 | Abandoned |
Array
(
[id] => 10551331
[patent_doc_number] => 09275963
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-03-01
[patent_title] => 'Semiconductor structure having stage difference surface and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/199640
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/199640 | Semiconductor structure having stage difference surface and manufacturing method thereof | Mar 5, 2014 | Issued |
Array
(
[id] => 10624405
[patent_doc_number] => 09343355
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[patent_issue_date] => 2016-05-17
[patent_title] => 'Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 14/197729
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/197729 | Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same | Mar 4, 2014 | Issued |
Array
(
[id] => 9914430
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[patent_title] => 'SEMICONDUCTOR DEVICE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/194783 | SEMICONDUCTOR DEVICE | Mar 1, 2014 | Abandoned |
Array
(
[id] => 9898973
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Array
(
[id] => 10537690
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[patent_title] => 'Semiconductor device having parallel conductive lines including a cut portion and method of manufacturing the same'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/190775 | Semiconductor device and semiconductor package having a plurality of differential signal balls | Feb 25, 2014 | Issued |
Array
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Array
(
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/188881 | Semiconductor package assembly with decoupling capacitor | Feb 24, 2014 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/189083 | Semiconductor apparatus having through via capable of testing connectivity of through via | Feb 24, 2014 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/181781 | Method of forming semiconductor fins and insulating fence fins on a same substrate | Feb 16, 2014 | Issued |