Search

Alexander O Williams

Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9914395 [patent_doc_number] => 20150069599 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-12 [patent_title] => 'Power electronic switching device and assembly' [patent_app_type] => utility [patent_app_number] => 14/120385 [patent_app_country] => US [patent_app_date] => 2014-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4010 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14120385 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/120385
Power electronic switching device and assembly May 13, 2014 Issued
Array ( [id] => 10260134 [patent_doc_number] => 20150145131 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-28 [patent_title] => 'SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/262537 [patent_app_country] => US [patent_app_date] => 2014-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6435 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14262537 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/262537
Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same Apr 24, 2014 Issued
Array ( [id] => 10260119 [patent_doc_number] => 20150145116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-28 [patent_title] => 'DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS' [patent_app_type] => utility [patent_app_number] => 14/250317 [patent_app_country] => US [patent_app_date] => 2014-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 11904 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14250317 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/250317
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects Apr 9, 2014 Issued
Array ( [id] => 9639510 [patent_doc_number] => 20140217620 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-07 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/248406 [patent_app_country] => US [patent_app_date] => 2014-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 22684 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14248406 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/248406
Semiconductor device with resin mold Apr 8, 2014 Issued
Array ( [id] => 13653377 [patent_doc_number] => 09853009 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-12-26 [patent_title] => Semiconductor module having a conductor member for reducing thermal stress [patent_app_type] => utility [patent_app_number] => 15/126609 [patent_app_country] => US [patent_app_date] => 2014-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2957 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15126609 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/126609
Semiconductor module having a conductor member for reducing thermal stress Apr 3, 2014 Issued
Array ( [id] => 11495403 [patent_doc_number] => 20170069589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-03-09 [patent_title] => 'ANCHORED INTERCONNECT' [patent_app_type] => utility [patent_app_number] => 15/120788 [patent_app_country] => US [patent_app_date] => 2014-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4552 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15120788 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/120788
Anchored interconnect Mar 27, 2014 Issued
Array ( [id] => 10277291 [patent_doc_number] => 20150162288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-06-11 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/209535 [patent_app_country] => US [patent_app_date] => 2014-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7342 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14209535 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/209535
Semiconductor device Mar 12, 2014 Issued
Array ( [id] => 9905953 [patent_doc_number] => 20150061153 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-05 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/203729 [patent_app_country] => US [patent_app_date] => 2014-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7769 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14203729 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/203729
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Mar 10, 2014 Abandoned
Array ( [id] => 10551331 [patent_doc_number] => 09275963 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-01 [patent_title] => 'Semiconductor structure having stage difference surface and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 14/199640 [patent_app_country] => US [patent_app_date] => 2014-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4611 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14199640 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/199640
Semiconductor structure having stage difference surface and manufacturing method thereof Mar 5, 2014 Issued
Array ( [id] => 10624405 [patent_doc_number] => 09343355 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-17 [patent_title] => 'Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/197729 [patent_app_country] => US [patent_app_date] => 2014-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 35 [patent_no_of_words] => 9370 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14197729 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/197729
Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same Mar 4, 2014 Issued
Array ( [id] => 9914430 [patent_doc_number] => 20150069634 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-12 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/194783 [patent_app_country] => US [patent_app_date] => 2014-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3478 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14194783 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/194783
SEMICONDUCTOR DEVICE Mar 1, 2014 Abandoned
Array ( [id] => 9898973 [patent_doc_number] => 20150054172 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-02-26 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/194776 [patent_app_country] => US [patent_app_date] => 2014-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3538 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14194776 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/194776
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Mar 1, 2014 Abandoned
Array ( [id] => 10537690 [patent_doc_number] => 09263323 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-16 [patent_title] => 'Semiconductor device having parallel conductive lines including a cut portion and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/194433 [patent_app_country] => US [patent_app_date] => 2014-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 51 [patent_no_of_words] => 9674 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14194433 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/194433
Semiconductor device having parallel conductive lines including a cut portion and method of manufacturing the same Feb 27, 2014 Issued
Array ( [id] => 10551315 [patent_doc_number] => 09275947 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-01 [patent_title] => 'Semiconductor device and semiconductor package having a plurality of differential signal balls' [patent_app_type] => utility [patent_app_number] => 14/190775 [patent_app_country] => US [patent_app_date] => 2014-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 22 [patent_no_of_words] => 10943 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14190775 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/190775
Semiconductor device and semiconductor package having a plurality of differential signal balls Feb 25, 2014 Issued
Array ( [id] => 9914392 [patent_doc_number] => 20150069596 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-12 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/190921 [patent_app_country] => US [patent_app_date] => 2014-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4523 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14190921 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/190921
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Feb 25, 2014 Abandoned
Array ( [id] => 10563516 [patent_doc_number] => 09287198 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-15 [patent_title] => 'Interconnection structure including air gap, semiconductor device including air gap, and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 14/190990 [patent_app_country] => US [patent_app_date] => 2014-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 15 [patent_no_of_words] => 6625 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14190990 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/190990
Interconnection structure including air gap, semiconductor device including air gap, and method of manufacturing the same Feb 25, 2014 Issued
Array ( [id] => 10158554 [patent_doc_number] => 09190338 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-11-17 [patent_title] => 'Semiconductor package having a heat slug and a spacer' [patent_app_type] => utility [patent_app_number] => 14/188917 [patent_app_country] => US [patent_app_date] => 2014-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 5357 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14188917 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/188917
Semiconductor package having a heat slug and a spacer Feb 24, 2014 Issued
Array ( [id] => 9729105 [patent_doc_number] => 20140264812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'SEMICONDUCTOR PACKAGE ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 14/188881 [patent_app_country] => US [patent_app_date] => 2014-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3154 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14188881 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/188881
Semiconductor package assembly with decoupling capacitor Feb 24, 2014 Issued
Array ( [id] => 10230441 [patent_doc_number] => 20150115435 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-30 [patent_title] => 'SEMICONDUCTOR APPARATUS INCLUDING THROUGH VIA' [patent_app_type] => utility [patent_app_number] => 14/189083 [patent_app_country] => US [patent_app_date] => 2014-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3785 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14189083 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/189083
Semiconductor apparatus having through via capable of testing connectivity of through via Feb 24, 2014 Issued
Array ( [id] => 10351013 [patent_doc_number] => 20150236018 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-20 [patent_title] => 'FABRICATION OF INSULATING FENCE FINS' [patent_app_type] => utility [patent_app_number] => 14/181781 [patent_app_country] => US [patent_app_date] => 2014-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3690 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14181781 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/181781
Method of forming semiconductor fins and insulating fence fins on a same substrate Feb 16, 2014 Issued
Menu